Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11999027 | Method for polishing semiconductor substrate | James Jeng-Jyi Hwang, He Hui Peng, Chi-Ming Yang | 2024-06-04 |
| 11772227 | Device and methods for chemical mechanical polishing | James Jeng-Jyi Hwang, He Hui Peng, Chi-Ming Yang | 2023-10-03 |
| 11602821 | Wafer polishing head, system thereof, and method using the same | James Jeng-Jyi Hwang, He Hui Peng, Chi-Ming Yang | 2023-03-14 |
| 10875143 | Apparatus and methods for chemical mechanical polishing | James Jeng-Jyi Hwang, He Hui Peng, Chi-Ming Yang | 2020-12-29 |
| 10513006 | High throughput CMP platform | Jason Shen, Soon-Kang Huang, James Jeng-Jyi Hwang, Chi-Ming Yang | 2019-12-24 |
| 10090207 | Multi-point chemical mechanical polishing end point detection system and method of using | Jeng-Jyi Hwang, Soon-Kang Huang, Chi-Ming Yang | 2018-10-02 |
| 10065288 | Chemical mechanical polishing (CMP) platform for local profile control | Chi-Ming Yang, James Jeng-Jyi Hwang | 2018-09-04 |
| 9138861 | CMP pad cleaning apparatus | Bo-I Lee, Huang Soon Kang, Chi-Ming Yang, Chin-Hsiang Lin | 2015-09-22 |
| 6998013 | CMP apparatus polishing head with concentric pressure zones | Chin-Tsan Jan | 2006-02-14 |