Issued Patents All Time
Showing 1–25 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D1063712 | Electric bicycle | Yun Cheng, Ker-Wei Lin, Hao-Ming Chang, Chun-Ta Chen, Wei-Chen Lee | 2025-02-25 |
| D1062545 | Electric bicycle | Yun Cheng, Ker-Wei Lin, Hao-Ming Chang, Chun-Ta Chen, Wei-Chen Lee | 2025-02-18 |
| 12199873 | Scalable E2E network architecture and components to support low latency and high throughput | Vahid Tabatabaee, Niranjan Vaidya, Mark Griswold | 2025-01-14 |
| 12125826 | Wafer-level stacked die structures and associated systems and methods | — | 2024-10-22 |
| 12113532 | Pseudo resistor with autotune function | Yu-Te Liao, Wei-Cheng Liu | 2024-10-08 |
| 12074122 | Inductor structure, semiconductor package and fabrication method thereof | Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu, Chen-Hua Yu | 2024-08-27 |
| 12040281 | Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof | Chuei-Tang Wang, Chen-Hua Yu, Chung-Shi Liu, Jiun Yi Wu, Jeng-Shien Hsieh +1 more | 2024-07-16 |
| 11871146 | Video processor for handling irregular input | I-Feng Lin, Hsiao-En Chang | 2024-01-09 |
| 11830841 | Semiconductor package and method for manufacturing the same | Chuei-Tang Wang, Chih-Chieh Chang, Yu-Kuang Liao, Hsing-Kuo Hsia, Jeng-Shien Hsieh +1 more | 2023-11-28 |
| 11729099 | Scalable E2E network architecture and components to support low latency and high throughput | Vahid Tabatabaee, Niranjan Vaidya, Mark Griswold | 2023-08-15 |
| 11658134 | Inductor structure, semiconductor package and fabrication method thereof | Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu, Chen-Hua Yu | 2023-05-23 |
| 11562926 | Package structure and method of forming thereof | Chih-Lin Chen, Chung-Hao Tsai, Jeng-Shien Hsieh, Chuei-Tang Wang, Chen-Hua Yu | 2023-01-24 |
| 11503247 | Method of MEMC and related video processor | I-Feng Lin, Hsiao-En Chang | 2022-11-15 |
| 11479498 | Glass composition and glass fiber having the same | Wen-Ho HSU, Bih-Cherng CHERN, Yueh-Heng Lee, Wei-Chih LO | 2022-10-25 |
| 11444059 | Wafer-level stacked die structures and associated systems and methods | — | 2022-09-13 |
| 11322470 | Optical semiconductor package and method for manufacturing the same | Chuei-Tang Wang, Chih-Chieh Chang, Yu-Kuang Liao, Hsing-Kuo Hsia, Jeng-Shien Hsieh +1 more | 2022-05-03 |
| 11302649 | Semiconductor device with shielding structure for cross-talk reduction | Shih-Ya Huang, Chung-Hao Tsai, Chuei-Tang Wang, Chen-Hua Yu | 2022-04-12 |
| 11262865 | Sensor device and system and related controller, multiplexer and panel apparatus | Chih-Chang Lai | 2022-03-01 |
| 11250232 | Fingerprint detecting system and related method | Hung-Kai Chen, Ting-Hsuan Hung, Feng-Lin Chan | 2022-02-15 |
| 11195817 | Semiconductor package and manufacturing method thereof | Shih-Ya Huang, Chung-Hao Tsai, Chen-Hua Yu, Chuei-Tang Wang | 2021-12-07 |
| 11190198 | Switched capacitor circuit and capacitive DAC | Guan-Ying Huang | 2021-11-30 |
| 11095065 | Combination structure of socket of power supply device | — | 2021-08-17 |
| 11094634 | Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof | Chuei-Tang Wang, Chen-Hua Yu, Chung-Shi Liu, Jiun Yi Wu, Jeng-Shien Hsieh +1 more | 2021-08-17 |
| 11075136 | Heat transfer structures and methods for IC packages | Ying-Chih Hsu, Alan Roth, Chuei-Tang Wang, Eric Soenen, Chih-Lin Chen | 2021-07-27 |
| 11062650 | Sensing circuit and a source driver of a display device | Feng-Lin Chan | 2021-07-13 |