CC

Chih-Lin Chen

TSMC: 10 patents #2,782 of 12,232Top 25%
NU National Sun Yat-Sen University: 1 patents #156 of 426Top 40%
MC Macronix International Co.: 1 patents #718 of 1,241Top 60%
Overall (All Time): #400,056 of 4,157,543Top 10%
12
Patents All Time

Issued Patents All Time

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
12411508 Semiconductor devices including voltage monitors Chung-Sheng Yuan 2025-09-09
12062641 Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing same Hui Yu Lee, Fong-Yuan Chang, Po-Hsiang Huang, Chin-Chou Liu 2024-08-13
11658157 Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing same Hui Yu Lee, Fong-Yuan Chang, Po-Hsiang Huang, Chin-Chou Liu 2023-05-23
11562926 Package structure and method of forming thereof Chung-Hao Tsai, Jeng-Shien Hsieh, Chuei-Tang Wang, Chen-Hua Yu, Chih-Yuan Chang 2023-01-24
11075136 Heat transfer structures and methods for IC packages Ying-Chih Hsu, Alan Roth, Chuei-Tang Wang, Chih-Yuan Chang, Eric Soenen 2021-07-27
11043473 Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing same Chin-Chou Liu, Fong-Yuan Chang, Hui Yu Lee, Po-Hsiang Huang 2021-06-22
10763164 Package structure with inductor and method of forming thereof Chung-Hao Tsai, Jeng-Shien Hsieh, Chuei-Tang Wang, Chen-Hua Yu, Chih-Yuan Chang 2020-09-01
10559517 Heat transfer structures and methods for IC packages Ying-Chih Hsu, Alan Roth, Chuei-Tang Wang, Chih-Yuan Chang, Eric Soenen 2020-02-11
10535635 Second semiconductor wafer attached to a first semiconductor wafer with a through hole connected to an inductor Chin-Chou Liu, Fong-Yuan Chang, Hui Yu Lee, Po-Hsiang Huang 2020-01-14
10163751 Heat transfer structures and methods for IC packages Ying-Chih Hsu, Alan Roth, Chuei-Tang Wang, Chih-Yuan Chang, Eric Soenen 2018-12-25
8983402 Transceiver with wake up detection Chua-Chin Wang, Jie Li, Gang-Neng Sung, Tai-Hao Yeh, Chun-Ying Juan +1 more 2015-03-17
7923770 Memory device and method of fabricating the same Kuang-Wen Liu, Hsin-Huei Chen 2011-04-12