Issued Patents All Time
Showing 51–75 of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9331032 | Hybrid bonding and apparatus for performing the same | Ping-Yin Liu, Xin-Hua Huang, Chih-Hui Huang, Yeur-Luen Tu, Yan-Chih Lu +2 more | 2016-05-03 |
| 9293303 | Low contamination chamber for surface activation | Ping-Yin Liu, Xin-Hua Huang, Lee-Chuan Tseng | 2016-03-22 |
| 9257399 | 3D integrated circuit and methods of forming the same | Hsun-Chung Kuang, Yen-Chang Chu, Cheng-Tai Hsiao, Ping-Yin Liu, Yeur-Luen Tu +2 more | 2016-02-09 |
| 9242853 | Method of improving getter efficiency by increasing superficial area | Yuan-Chih Hsieh, Li-Cheng Chu, Hung-Hua Lin, Chih-Jen Chan | 2016-01-26 |
| 9142517 | Hybrid bonding mechanisms for semiconductor wafers | Ping-Yin Liu, Szu-Ying Chen, Chen-Jong Wang, Chih-Hui Huang, Xin-Hua Huang +3 more | 2015-09-22 |
| 9136302 | Apparatus for vertically integrated backside illuminated image sensors | Tzu-Jui Wang, Szu-Ying Chen, Jen-Cheng Liu, Dun-Nian Yaung, Ping-Yin Liu | 2015-09-15 |
| 9099476 | Semiconductor having a high aspect ratio via | Yuan-Chih Hsieh, Li-Cheng Chu, Ming-Tung Wu, Ping-Yin Liu, Chia-Shiung Tsai | 2015-08-04 |
| 9054121 | MEMS structures and methods for forming the same | Ping-Yin Liu, Xin-Hua Huang, Hsin-Ting Huang, Yuan-Chih Hsieh, Jung-Huei Peng +2 more | 2015-06-09 |
| 9048283 | Hybrid bonding systems and methods for semiconductor wafers | Ping-Yin Liu, Shih-Wei Lin, Xin-Hua Huang, Chia-Shiung Tsai | 2015-06-02 |
| 8945344 | Systems and methods of separating bonded wafers | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Yuan-Chih Hsieh, Chia-Shiung Tsai | 2015-02-03 |
| 8905293 | Self-removal anti-stiction coating for bonding process | Ping-Yin Liu, Li-Cheng Chu, Hung-Hua Lin, Shang-Ying Tsai, Yuan-Chih Hsieh +3 more | 2014-12-09 |
| 8846129 | Biological sensing structures and methods of forming the same | Hung-Hua Lin, Li-Cheng Chu, Ming-Tung Wu, Yuan-Chih Hsieh, Chia-Shiung Tsai | 2014-09-30 |
| 8836055 | MEMS structures and methods for forming the same | Lung Yuan Pan, Chia-Shiung Tsai | 2014-09-16 |
| 8809123 | Three dimensional integrated circuit structures and hybrid bonding methods for semiconductor wafers | Ping-Yin Liu, Xin-Hua Huang, Chia-Shiung Tsai | 2014-08-19 |
| 8802538 | Methods for hybrid wafer bonding | Ping-Yin Liu, Jen-Cheng Liu, Xiaomeng Chen, Xin-Hua Huang, Hung-Hua Lin +1 more | 2014-08-12 |
| 8790946 | Methods of bonding caps for MEMS devices | Xin-Hua Huang, Ping-Yin Liu, Li-Cheng Chu, Yuan-Chih Hsieh, Chun-Wen Cheng +1 more | 2014-07-29 |
| 8728845 | Method and apparatus for selectively removing anti-stiction coating | Shih-Wei Lin, Ping-Yin Liu, Jung-Huei Peng, Chia-Shiung Tsai | 2014-05-20 |
| 8647962 | Wafer level packaging bond | Martin Liu, Richard Chu, Hung-Hua Lin, Hsin-Ting Huang, Jung-Huei Peng +3 more | 2014-02-11 |
| 8648468 | Hermetic wafer level packaging | Richard Chu, Martin Liu, Chia-Hua Chu, Yuan-Chih Hsieh, Chung-Hsien Lin +2 more | 2014-02-11 |
| 8629524 | Apparatus for vertically integrated backside illuminated image sensors | Tzu-Jui Wang, Szu-Ying Chen, Jen-Cheng Liu, Dun-Nian Yaung, Ping-Yin Liu | 2014-01-14 |
| 8598687 | Semiconductor having a high aspect ratio via | Yuan-Chih Hsieh, Richard Chu, Ming-Tung Wu, Martin Liu, Chia-Shiung Tsai | 2013-12-03 |
| 8445380 | Semiconductor having a high aspect ratio via | Yuan-Chih Hsieh, Richard Chu, Ming-Tung Wu, Martin Liu, Chia-Shiung Tsai | 2013-05-21 |
| 8405169 | Handling layer for transparent substrate | Chun-Ren Cheng, Yi-Hsien Chang, Allen Timothy Chang, Ching-Ray Chen, Li-Cheng Chu +2 more | 2013-03-26 |
| 8207595 | Semiconductor having a high aspect ratio via | Yuan-Chih Hsieh, Richard Chu, Ming-Tung Wu, Martin Liu, Chia-Shiung Tsai | 2012-06-26 |
| 7851324 | Method of forming metal-insulator-metal structure | Yu-Jen Wang, Chia-Shiung Tsai, Yeur-Luen Tu, Chih-Ta Wu, Hsing-Lien Lin +1 more | 2010-12-14 |