Issued Patents All Time
Showing 1–25 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237165 | Method for wafer bonding including edge trimming | Yung-Lung Lin, Hau-Yi Hsiao, Kuo-Hwa Tzeng, Cheng-Hsien Chou | 2025-02-25 |
| 12211741 | Multi-wafer capping layer for metal arcing protection | Cheng-Hsien Chou, Cheng-Yuan Tsai, Kuo-Ming Wu, Sheng-Chan Li | 2025-01-28 |
| 12142628 | Method of forming semiconductor device | Chi-Ming Lu, Sheng-Chan Li, Jung-Chih Tsao, Yao-Hsiang Liang | 2024-11-12 |
| 11915977 | Interconnect structure for stacked device | Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung +3 more | 2024-02-27 |
| 11862515 | Multi-wafer capping layer for metal arcing protection | Cheng-Hsien Chou, Cheng-Yuan Tsai, Kuo-Ming Wu, Sheng-Chan Li | 2024-01-02 |
| 11610812 | Multi-wafer capping layer for metal arcing protection | Cheng-Hsien Chou, Cheng-Yuan Tsai, Kuo-Ming Wu, Sheng-Chan Li | 2023-03-21 |
| 11404470 | Method of forming deep trench isolation in radiation sensing substrate and image sensor device | Chi-Ming Lu, Jung-Chih Tsao, Yao-Hsiang Liang, Chih-Chang Huang, Ching-Ho Hsu | 2022-08-02 |
| 11387274 | Method of forming semiconductor device | Chi-Ming Lu, Sheng-Chan Li, Jung-Chih Tsao, Yao-Hsiang Liang | 2022-07-12 |
| 11276587 | Wafer bonding method and apparatus with curved surfaces | Chun-Han Tsao, Sheng-Chau Chen, Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen | 2022-03-15 |
| 11189654 | Manufacturing methods of semiconductor image sensor devices | Chao-Ching Chang, Sheng-Chan Li, Jian-Shin Tsai, Cheng-Yi Wu, Chia-Hsing Chou +3 more | 2021-11-30 |
| 11139210 | Bonding support structure (and related process) for wafer stacking | Sheng-Chan Li, Cheng-Hsien Chou, Cheng-Yuan Tsai, Kuo-Ming Wu | 2021-10-05 |
| 11087971 | Method for manufacturing semiconductor device and manufacturing method of the same | Yung-Lung Lin, Hau-Yi Hsiao, Kuo-Hwa Tzeng, Cheng-Hsien Chou | 2021-08-10 |
| 11041242 | Gas shower head with plural hole patterns and with corresponding different plural hole densities and film formation method | Sheng-Chan Li, Cheng-Hsien Chou, Cheng-Yuan Tsai | 2021-06-22 |
| 10978345 | Interconnect structure for stacked device | Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung +3 more | 2021-04-13 |
| 10879288 | Reflector for backside illuminated (BSI) image sensor | Cheng-Hsien Chou, Cheng-Yuan Tsai, Kuo-Ming Wu, Sheng-Chan Li | 2020-12-29 |
| 10734285 | Bonding support structure (and related process) for wafer stacking | Sheng-Chan Li, Cheng-Hsien Chou, Cheng-Yuan Tsai, Kuo-Ming Wu | 2020-08-04 |
| 10727097 | Mechanisms for cleaning substrate surface for hybrid bonding | Sheng-Chau Chen, Yeur-Luen Tu, Cheng-Ta Wu, Chia-Shiung Tsai, Xiao-Meng Chen | 2020-07-28 |
| 10526703 | Film formation apparatus for forming semiconductor structure having shower head with plural hole patterns and with corresponding different plural hole densities | Sheng-Chan Li, Cheng-Hsien Chou, Cheng-Yuan Tsai | 2020-01-07 |
| 10510798 | Method of forming deep trench isolation in radiation sensing substrate and image sensor device | Chi-Ming Lu, Jung-Chih Tsao, Yao-Hsiang Liang, Chih-Chang Huang, Ching-Ho Hsu | 2019-12-17 |
| 10504756 | Wafer processing method and apparatus | Chun-Han Tsao, Sheng-Chau Chen, Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen | 2019-12-10 |
| 10504716 | Method for manufacturing semiconductor device and manufacturing method of the same | Yung-Lung Lin, Hau-Yi Hsiao, Kuo-Hwa Tzeng, Cheng-Hsien Chou | 2019-12-10 |
| 10475847 | Semiconductor device having stress-neutralized film stack and method of fabricating same | Chi-Ming Lu, Sheng-Chan Li, Jung-Chih Tsao, Yao-Hsiang Liang | 2019-11-12 |
| 10177106 | Conductive pad structure for hybrid bonding and methods of forming same | Sheng-Chau Chen, Shih Pei Chou, Yen-Chang Chu, Cheng-Hsien Chou, Yeur-Luen Tu | 2019-01-08 |
| 10134801 | Method of forming deep trench isolation in radiation sensing substrate and image sensor device | Chi-Ming Lu, Jung-Chih Tsao, Yao-Hsiang Liang, Chih-Chang Huang, Ching-Ho Hsu | 2018-11-20 |
| 10096515 | Interconnect structure for stacked device | Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung +3 more | 2018-10-09 |