Issued Patents All Time
Showing 26–46 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10062720 | Deep trench isolation fabrication for BSI image sensor | Yen-Ting Chiang, Ching-Chun Wang, Dun-Nian Yaung, Hsiao-Hui Tseng, Shyh-Fann Ting +2 more | 2018-08-28 |
| 10062656 | Composite bond structure in stacked semiconductor structure | Chao-Ching Chang, Sheng-Chan Li, Wen-Jen Tsai, Jian-Shin Tsai, Cheng-Yi Wu +2 more | 2018-08-28 |
| 9960129 | Hybrid bonding mechanisms for semiconductor wafers | Ping-Yin Liu, Szu-Ying Chen, Chen-Jong Wang, Xin-Hua Huang, Lan-Lin Chao +3 more | 2018-05-01 |
| 9960200 | Selective deposition and planarization for a CMOS image sensor | Sheng-Chan Li, Cheng-Hsien Chou, Sheng-Chau Chen, Cheng-Yuan Tsai | 2018-05-01 |
| 9859326 | Semiconductor devices, image sensors, and methods of manufacture thereof | Sheng-Chau Chen, Tung-Ting Wu, Cheng-Ta Wu, Yeur-Luen Tu, Jhy-Jyi Sze | 2018-01-02 |
| 9842816 | Conductive pad structure for hybrid bonding and methods of forming same | Sheng-Chau Chen, Shih Pei Chou, Yen-Chang Chu, Cheng-Hsien Chou, Yeur-Luen Tu | 2017-12-12 |
| 9837291 | Wafer processing method and apparatus | Chun-Han Tsao, Sheng-Chau Chen, Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen | 2017-12-05 |
| 9754813 | Bond chuck, methods of bonding, and tool including bond chuck | Yen-Chang Chu, Kuan-Liang Liu, Ping-Yin Liu, Cheng-Yuan Tsai, Yeur-Luen Tu +2 more | 2017-09-05 |
| 9728570 | Deep trench isolation fabrication for BSI image sensor | Yen-Ting Chiang, Ching-Chun Wang, Dun-Nian Yaung, Hsiao-Hui Tseng, Shyh-Fann Ting +2 more | 2017-08-08 |
| 9728521 | Hybrid bond using a copper alloy for yield improvement | Yu-Cheng Tsai, Chun-Chieh Chuang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung +2 more | 2017-08-08 |
| 9508769 | Semiconductor structure and method of manufacturing the same | Sheng-Chan Li, Cheng-Yuan Tsai, Yeur-Luen Tu | 2016-11-29 |
| 9490158 | Bond chuck, methods of bonding, and tool including bond chuck | Yen-Chang Chu, Kuan-Liang Liu, Ping-Yin Liu, Cheng-Yuan Tsai, Yeur-Luen Tu +2 more | 2016-11-08 |
| 9437572 | Conductive pad structure for hybrid bonding and methods of forming same | Sheng-Chau Chen, Shih Pei Chou, Yen-Chang Chu, Cheng-Hsien Chou, Yeur-Luen Tu | 2016-09-06 |
| 9331032 | Hybrid bonding and apparatus for performing the same | Ping-Yin Liu, Xin-Hua Huang, Lan-Lin Chao, Yeur-Luen Tu, Yan-Chih Lu +2 more | 2016-05-03 |
| 9252296 | Semiconductor device with compressive layers | Chun-Han Tsao, Chih-Yu Lai, Cheng-Ta Wu, Yeur-Luen Tu, Ching-Chun Wang +2 more | 2016-02-02 |
| 9190441 | Image sensor trench isolation with conformal doping | Chih-Yu Lai, Yeur-Luen Tu, Cheng-Ta Wu, Chia-Shiung Tsai, Luan C. Tran | 2015-11-17 |
| 9142517 | Hybrid bonding mechanisms for semiconductor wafers | Ping-Yin Liu, Szu-Ying Chen, Chen-Jong Wang, Xin-Hua Huang, Lan-Lin Chao +3 more | 2015-09-22 |
| 9059057 | Image sensor having compressive layers | Chun-Han Tsao, Chih-Yu Lai, Cheng-Ta Wu, Yeur-Luen Tu, Ching-Chun Wang +2 more | 2015-06-16 |
| 9040385 | Mechanisms for cleaning substrate surface for hybrid bonding | Sheng-Chau Chen, Yeur-Luen Tu, Cheng-Ta Wu, Chia-Shiung Tsai, Xiao-Meng Chen | 2015-05-26 |
| 8853811 | Image sensor trench isolation with conformal doping | Chih-Yu Lai, Yeur-Luen Tu, Cheng-Ta Wu, Chia-Shiung Tsai, Luan C. Tran | 2014-10-07 |
| 8377733 | Antireflective layer for backside illuminated image sensor and method of manufacturing same | Cheng-Yuan Tsai, Yeur-Luen Tu, Chia-Shiung Tsai, Dun-Nian Yaung, Jen-Cheng Liu | 2013-02-19 |