Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154866 | Method of fabricating a flip-chip package core substrate with build-up layers | Pao-Hung Chou, Shih-Ping Hsu, Tung-Yao Kuo | 2024-11-26 |
| 12094922 | Inductance traces protected through shielding layers | Pao-Hung Chou, Shih-Ping Hsu | 2024-09-17 |
| 11887299 | Image processing system and image processing method | Jehn-Yu Huang, Cheng-Tien Hsieh, Yun-Ting Lin | 2024-01-30 |
| 11791281 | Package substrate and method for manufacturing the same | You-Lung Yen, Pao-Hung Chou | 2023-10-17 |
| 11749612 | Semiconductor package device | Shih-Ping Hsu, Hsien-Ming Tsai | 2023-09-05 |
| 11646331 | Package substrate | Hsien-Ming Tsai | 2023-05-09 |
| 11508673 | Semiconductor packaging substrate, fabrication method and packaging process thereof | Pao-Hung Chou | 2022-11-22 |
| 11483939 | Electronic device with display interface | You Li | 2022-10-25 |
| 11476204 | Flip-chip packaging substrate and method for fabricating the same | Pao-Hung Chou, Shih-Ping Hsu, Tung-Yao Kuo | 2022-10-18 |
| 11455498 | Model training method and electronic device | Cheng-Tien Hsieh, Shih-Ho Huang, Meng-Che Cheng, Kun-Hsien Chou, Ching-Po Lin +1 more | 2022-09-27 |
| 11450597 | Semiconductor package substrate having heat dissipating metal sheet on solder pads, method for fabricating the same, and electronic package having the same | Pao-Hung Chou, Shih-Ping Hsu | 2022-09-20 |
| 11404348 | Semiconductor package carrier board, method for fabricating the same, and electronic package having the same | Pao-Hung Chou, Shih-Ping Hsu, Wen-Chang Chen | 2022-08-02 |
| 11379722 | Method for training generative adversarial network (GAN), method for generating images by using GAN, and computer readable storage medium | Edward Chang, Che-Han Chang, Szu-Ying Chen | 2022-07-05 |
| 11335630 | Semiconductor package substrate, electronic package and methods for fabricating the same | Pao-Hung Chou, Shih-Ping Hsu | 2022-05-17 |
| 11253228 | Ultrasonic scanning method and ultrasonic scanning device | Kuo-Nan Chen | 2022-02-22 |
| 11238374 | Method for verifying training data, training system, and computer readable medium | Hao-Cheng Kao, Chih-Yang Chen, Shan-Yi Yu, Edzer Lienson Wu, Che-Han Chang | 2022-02-01 |
| 11183447 | Flip-chip package substrate and method for fabricating the same | Pao-Hung Chou, Shih-Ping Hsu | 2021-11-23 |
| 11139230 | Flip-chip package substrate and method for preparing the same | Pao-Hung Chou, Shih-Ping Hsu | 2021-10-05 |
| 10745818 | Method of fabricating package substrates | Shih-Ping Hsu, Pao-Hung Chou | 2020-08-18 |
| 10366906 | Electronic package and its package substrate | Hsien-Ming Tsai | 2019-07-30 |
| 10347575 | Package substrate and its fabrication method | Shih-Ping Hsu, Pao-Hung Chou, Chi-Feng Peng | 2019-07-09 |
| 10278282 | Substrate structure and manufacturing method thereof | Hsien-Ming Tsai | 2019-04-30 |
| 9852977 | Package substrate | Pao-Hung Chou | 2017-12-26 |
| 9824964 | Package substrate, package structure including the same, and their fabrication methods | Shih-Ping Hsu | 2017-11-21 |
| 9754982 | Packaging module and substrate structure thereof | Chu-Chin Hu, Shih-Ping Hsu | 2017-09-05 |