Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154866 | Method of fabricating a flip-chip package core substrate with build-up layers | Chun-Hsien Yu, Shih-Ping Hsu, Tung-Yao Kuo | 2024-11-26 |
| 12094922 | Inductance traces protected through shielding layers | Chun-Hsien Yu, Shih-Ping Hsu | 2024-09-17 |
| 11791281 | Package substrate and method for manufacturing the same | You-Lung Yen, Chun-Hsien Yu | 2023-10-17 |
| 11658104 | Intermediate substrate and fabrication method thereof | Shih-Ping Hsu, Chu-Chin Hu | 2023-05-23 |
| 11508673 | Semiconductor packaging substrate, fabrication method and packaging process thereof | Chun-Hsien Yu | 2022-11-22 |
| 11476204 | Flip-chip packaging substrate and method for fabricating the same | Chun-Hsien Yu, Shih-Ping Hsu, Tung-Yao Kuo | 2022-10-18 |
| 11450597 | Semiconductor package substrate having heat dissipating metal sheet on solder pads, method for fabricating the same, and electronic package having the same | Chun-Hsien Yu, Shih-Ping Hsu | 2022-09-20 |
| 11404348 | Semiconductor package carrier board, method for fabricating the same, and electronic package having the same | Chun-Hsien Yu, Shih-Ping Hsu, Wen-Chang Chen | 2022-08-02 |
| 11335630 | Semiconductor package substrate, electronic package and methods for fabricating the same | Chun-Hsien Yu, Shih-Ping Hsu | 2022-05-17 |
| 11183447 | Flip-chip package substrate and method for fabricating the same | Chun-Hsien Yu, Shih-Ping Hsu | 2021-11-23 |
| 11139230 | Flip-chip package substrate and method for preparing the same | Chun-Hsien Yu, Shih-Ping Hsu | 2021-10-05 |
| 11069540 | Package on package and a method of fabricating the same | — | 2021-07-20 |
| 10745818 | Method of fabricating package substrates | Chun-Hsien Yu, Shih-Ping Hsu | 2020-08-18 |
| 10483194 | Interposer substrate and method of fabricating the same | Shih-Ping Hsu | 2019-11-19 |
| 10347575 | Package substrate and its fabrication method | Chun-Hsien Yu, Shih-Ping Hsu, Chi-Feng Peng | 2019-07-09 |
| 10117340 | Manufacturing method of package substrate with metal on conductive portions | Che-Wei Hsu, Shih-Ping Hsu | 2018-10-30 |
| 10014242 | Interposer substrate and method of fabricating the same | Shih-Ping Hsu | 2018-07-03 |
| 9992879 | Package substrate with metal on conductive portions and manufacturing method thereof | Che-Wei Hsu, Shih-Ping Hsu | 2018-06-05 |
| 9911626 | Interposer substrate and method for fabricating the same | — | 2018-03-06 |
| 9852977 | Package substrate | Chun-Hsien Yu | 2017-12-26 |
| 9806050 | Method of fabricating package structure | Chih-Hao Hsu | 2017-10-31 |
| 9780022 | Substrate structure | — | 2017-10-03 |
| 9342772 | Substrate structure and method of manufacturing the same | — | 2016-05-17 |
| 9338900 | Interposer substrate and method of fabricating the same | Shih-Ping Hsu, Che-Wei Hsu | 2016-05-10 |
| 9230895 | Package substrate and fabrication method thereof | Hsien-Min Chang | 2016-01-05 |