Issued Patents All Time
Showing 25 most recent of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12283537 | Electronic package and method of forming the same | Bernd Karl Appelt | 2025-04-22 |
| 12198999 | Electronic package including a protection layer | Bernd Karl Appelt | 2025-01-14 |
| 12009317 | Semiconductor package structure and method for manufacturing the same | Bernd Karl Appelt, Kay Stefan Essig | 2024-06-11 |
| 12002729 | Electronic package and method of manufacturing the same | Bernd Karl Appelt | 2024-06-04 |
| 12002743 | Electronic carrier and method of manufacturing the same | Bernd Karl Appelt | 2024-06-04 |
| 11961831 | Electronic package, semiconductor package structure, and method for manufacturing the semiconductor package structure | Bernd Karl Appelt | 2024-04-16 |
| 11881448 | Semiconductor package structure having substrate with embedded electronic component and conductive pillars | Bernd Karl Appelt, Kay Stefan Essig | 2024-01-23 |
| 11830799 | Semiconductor device package, antenna device, and method for manufacturing the same | Bernd Karl Appelt | 2023-11-28 |
| 11830798 | Semiconductor device package | Bernd Karl Appelt | 2023-11-28 |
| 11791245 | Electronic package and method for manufacturing the same | Bernd Karl Appelt, Kay Stefan Essig | 2023-10-17 |
| 11791281 | Package substrate and method for manufacturing the same | Pao-Hung Chou, Chun-Hsien Yu | 2023-10-17 |
| 11735433 | Substrate structure, package structure and method for manufacturing electronic package structure | Bernd Karl Appelt | 2023-08-22 |
| 11705401 | Semiconductor package structure and method for manufacturing the same | Bernd Karl Appelt, Kay Stefan Essig | 2023-07-18 |
| 11682656 | Semiconductor device package and method for manufacturing the same | Bernd Karl Appelt, Kay Stefan Essig | 2023-06-20 |
| 11664339 | Package structure and method for manufacturing the same | Bernd Karl Appelt | 2023-05-30 |
| 11664301 | Semiconductor device package | Bernd Karl Appelt | 2023-05-30 |
| 11631633 | Substrate structure, semiconductor package structure and method for manufacturing semiconductor package structure | Kuang-Hsiung Chen, Bernd Karl Appelt | 2023-04-18 |
| 11616007 | Electronic package | Bernd Karl Appelt, Kay Stephan Essig | 2023-03-28 |
| 11610834 | Leadframe including conductive pillar over land of conductive layer | Bernd Karl Appelt | 2023-03-21 |
| 11574856 | Semiconductor package | Bernd Karl Appelt, Kay Stefan Essig | 2023-02-07 |
| 11545406 | Substrate structure, semiconductor package structure and method for manufacturing a substrate structure | Bernd Karl Appelt, Kay Stefan Essig | 2023-01-03 |
| 11482480 | Package substrate including an optically-cured dielecetric layer and method for manufacturing the package substrate | — | 2022-10-25 |
| 11462484 | Electronic package with wettable flank and shielding layer and manufacturing method thereof | Bernd Karl Appelt, Kay Stephan Essig | 2022-10-04 |
| 11398421 | Semiconductor substrate and method for manufacturing the same | Chun-Che Lee, Ming-Chiang Lee, Yuan-Chang Su, Tien-Szu Chen, Chih-Cheng Lee | 2022-07-26 |
| 11322428 | Semiconductor device package and method of manufacturing the same | Bernd Karl Appelt | 2022-05-03 |