Issued Patents All Time
Showing 25 most recent of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12352602 | Optical module and method of making the same | Ying-Chung Chen, Hsun-Wei Chan, Lu-Ming Lai | 2025-07-08 |
| 11835363 | Optical module and method of making the same | Ying-Chung Chen, Hsun-Wei Chan, Lu-Ming Lai | 2023-12-05 |
| 11631633 | Substrate structure, semiconductor package structure and method for manufacturing semiconductor package structure | You-Lung Yen, Bernd Karl Appelt | 2023-04-18 |
| 11600567 | Semiconductor device package and method for manufacturing the same | Chih-Cheng Lee | 2023-03-07 |
| 11276806 | Semiconductor device package and method for manufacturing the same | Yi Wen Chiang, Lu-Ming Lai, Hsun-Wei Chan, Hsin-Ying Ho, Shih-Chieh Tang | 2022-03-15 |
| 11262197 | Optical module and method of making the same | Ying-Chung Chen, Hsun-Wei Chan, Lu-Ming Lai | 2022-03-01 |
| 11139225 | Device including a plurality of leads surrounding a die paddle and method for manufacturing the same | Chih-Hung Hsu, Mei-Lin Hsieh, Yi-Cheng Hsu, Yuan-Chun Chen, Yu-Shun Hsieh +1 more | 2021-10-05 |
| 10879159 | Substrate, semiconductor package thereof and process of making same | Tien-Szu Chen, Sheng-Ming Wang, Yu-Ying Lee | 2020-12-29 |
| 10734337 | Semiconductor package device having glass transition temperature greater than binding layer temperature | Yu-Hsuan Tsai, Yu-Ying Lee, Sheng-Ming Wang, Wun-Jheng Syu | 2020-08-04 |
| 10643863 | Semiconductor package and method of manufacturing the same | You-Lung Yen, Shing-Cheng Liang, Pei-Yu Hsu | 2020-05-05 |
| 10573624 | Semiconductor device package and method of manufacturing the same | Tien-Szu Chen, Sheng-Ming Wang, I-Cheng Wang, Wun-Jheng Syu | 2020-02-25 |
| 10515884 | Substrate having a conductive structure within photo-sensitive resin | Tien-Szu Chen, Sheng-Ming Wang, Yu-Ying Lee, Li-Chuan Tsai, Chih-Cheng Lee | 2019-12-24 |
| 10508910 | Optical module and method of making the same | Ying-Chung Chen, Hsun-Wei Chan, Lu-Ming Lai | 2019-12-17 |
| 10446411 | Semiconductor device package with a conductive post | Tien-Szu Chen, Sheng-Ming Wang, Yu-Ying Lee, Yu-Tzu Peng | 2019-10-15 |
| 10224298 | Semiconductor package device having glass transition temperature greater than binding layer temperature | Yu-Hsuan Tsai, Yu-Ying Lee, Sheng-Ming Wang, Wun-Jheng Syu | 2019-03-05 |
| 10157887 | Semiconductor device package and method of manufacturing the same | Tien-Szu Chen, Sheng-Ming Wang, I-Cheng Wang, Wun-Jheng Syu | 2018-12-18 |
| 10134683 | Semiconductor device package and method of manufacturing the same | Tien-Szu Chen, Sheng-Ming Wang, I-Cheng Wang, Wun-Jheng Syu, Yu-Tzu Peng | 2018-11-20 |
| 10103110 | Semiconductor package structure and fabrication method thereof | Tien-Szu Chen, Sheng-Ming Wang, Yu-Ying Lee | 2018-10-16 |
| 10049976 | Semiconductor substrate and manufacturing method thereof | Tien-Szu Chen, Chun-Che Lee, Sheng-Ming Wang, Yu-Ying Lee | 2018-08-14 |
| 10049893 | Semiconductor device with a conductive post | Tien-Szu Chen, Sheng-Ming Wang, Yu-Ying Lee, Yu-Tzu Peng | 2018-08-14 |
| 10002843 | Semiconductor substrate structure, semiconductor package and method of manufacturing the same | Tien-Szu Chen, Sheng-Ming Wang, Yu-Ying Lee | 2018-06-19 |
| 9984989 | Semiconductor substrate and semiconductor package structure | Tien-Szu Chen, Sheng-Ming Wang, Yu-Ying Lee | 2018-05-29 |
| 9911702 | Semiconductor package structure and fabrication method thereof | Tien-Szu Chen, Sheng-Ming Wang, Yu-Ying Lee | 2018-03-06 |
| 9196597 | Semiconductor package with single sided substrate design and manufacturing methods thereof | Yuan-Chang Su, Shih-Fu Huang, Chia-Cheng Chen, Tzu-Hui Chen, Pao-Ming Hsieh +2 more | 2015-11-24 |
| 9171792 | Semiconductor device packages having a side-by-side device arrangement and stacking functionality | Yu-Ching Sun, Fa-Hao Wu, Chi-Tsung Chiu | 2015-10-27 |