Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453764 | Molding for large panel fan-out package | Shao-An Chen, Po-Wei LU, Ming Tsung Shen | 2019-10-22 |
| 10446411 | Semiconductor device package with a conductive post | Tien-Szu Chen, Kuang-Hsiung Chen, Sheng-Ming Wang, Yu-Ying Lee | 2019-10-15 |
| 10134683 | Semiconductor device package and method of manufacturing the same | Tien-Szu Chen, Kuang-Hsiung Chen, Sheng-Ming Wang, I-Cheng Wang, Wun-Jheng Syu | 2018-11-20 |
| 10049893 | Semiconductor device with a conductive post | Tien-Szu Chen, Kuang-Hsiung Chen, Sheng-Ming Wang, Yu-Ying Lee | 2018-08-14 |