Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107056 | Semiconductor device package and the method of manufacturing the same | Ya Fang Chan, Yuan-Feng Chiang | 2024-10-01 |
| 11837557 | Semiconductor device package and a method of manufacturing the same | Peng Yang, Yuan-Feng Chiang | 2023-12-05 |
| 11189576 | Semiconductor device package and a method of manufacturing the same | Peng Yang, Yuan-Feng Chiang | 2021-11-30 |
| 11037853 | Semiconductor package structure and method of manufacturing the same | Ya Fang Chan, Yuan-Feng Chiang | 2021-06-15 |
| 10453764 | Molding for large panel fan-out package | Shao-An Chen, Ming Tsung Shen, Yu-Tzu Peng | 2019-10-22 |
| 9544695 | MEMS microphone device | Mao-Chen Liu, Hao-Ming CHAO, Wen-Chieh Chou, Shu-Yi WENG, Chun-Chieh Wang | 2017-01-10 |
| 9018771 | Thin film apparatus | Mao-Chen Liu, Wen-Chieh Chou, Chun-Chieh Wang, Shu-Yi WENG | 2015-04-28 |
| 8952464 | MEMS apparatus | Mao-Chen Liu, Wen-Chieh Chou, Shu-Yi WENG, Chun-Chieh Wang | 2015-02-10 |