Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272687 | Semiconductor device package with conductive pillars and reinforcing and encapsulating layers | Ya Fang Chan | 2025-04-08 |
| 12107056 | Semiconductor device package and the method of manufacturing the same | Ya Fang Chan, Po-Wei LU | 2024-10-01 |
| 11837557 | Semiconductor device package and a method of manufacturing the same | Peng Yang, Po-Wei LU | 2023-12-05 |
| 11791227 | Electronic device package | Kuoching CHENG, Ya Fang Chan, Wen-Long LU, Shih-Yu Wang | 2023-10-17 |
| 11521958 | Semiconductor device package with conductive pillars and reinforcing and encapsulating layers | Ya Fang Chan | 2022-12-06 |
| 11428946 | Method for manufacturing a through substrate via | Tsung-Tang Tsai, Min-Lung Huang | 2022-08-30 |
| 11189576 | Semiconductor device package and a method of manufacturing the same | Peng Yang, Po-Wei LU | 2021-11-30 |
| 11037853 | Semiconductor package structure and method of manufacturing the same | Ya Fang Chan, Po-Wei LU | 2021-06-15 |
| 10663746 | Collimator, optical device and method of manufacturing the same | Tsung-Tang Tsai, Min-Lung Huang | 2020-05-26 |
| 10344383 | Semiconductor package device and method of manufacturing the same | Chuan-Yung Shih, Tai-Yuan Huang, Yu-Chi Wang, Chin-Feng Wang, Sing-Syuan Shiau +3 more | 2019-07-09 |
| 10325854 | Interposer and semiconductor package device | Kun-Ming Chen | 2019-06-18 |
| 10211161 | Semiconductor package structure having a protection layer | Cong Chen, I-Ting Chi, Shao-An Chen | 2019-02-19 |
| 9947635 | Semiconductor package, interposer and semiconductor process for manufacturing the same | Wen-Long LU, Chi-Chang Lee, Chung-Hsi Wu | 2018-04-17 |
| 9929078 | Semiconductor package structure and method for manufacturing the same | Wen-Long LU, Chi-Chang Lee, Wei-Min Hsiao | 2018-03-27 |