Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272687 | Semiconductor device package with conductive pillars and reinforcing and encapsulating layers | Yuan-Feng Chiang | 2025-04-08 |
| 12107056 | Semiconductor device package and the method of manufacturing the same | Yuan-Feng Chiang, Po-Wei LU | 2024-10-01 |
| 11791227 | Electronic device package | Kuoching CHENG, Yuan-Feng Chiang, Wen-Long LU, Shih-Yu Wang | 2023-10-17 |
| 11521958 | Semiconductor device package with conductive pillars and reinforcing and encapsulating layers | Yuan-Feng Chiang | 2022-12-06 |
| 11056435 | Semiconductor package with chamfered pads | Cheng-Lin Ho, Chung-Chieh Chang, Chih-Cheng Lee | 2021-07-06 |
| 11037853 | Semiconductor package structure and method of manufacturing the same | Yuan-Feng Chiang, Po-Wei LU | 2021-06-15 |