Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12224481 | Semiconductor device package and method of manufacturing the same | Chih-Cheng Lee, Chun-Chen Chen, Yuanhao Yu | 2025-02-11 |
| 12165963 | Substrate, semiconductor device package and method of manufacturing the same | Chih-Cheng Lee | 2024-12-10 |
| 12007063 | Stand adjustment device | Pei-Chi Chu, Chi-Chia Huang, Wei-Ting Chen | 2024-06-11 |
| 11976776 | Stand adjustment device | Pei-Chi Chu, Chi-Chia Huang, Wei-Ting Chen | 2024-05-07 |
| 11946591 | Foldable stand | Chi-Chia Huang, Eric Langenhahn | 2024-04-02 |
| 11776885 | Substrate, semiconductor device package and method of manufacturing the same | Chih-Cheng Lee | 2023-10-03 |
| 11764137 | Semiconductor device package, electronic assembly and method for manufacturing the same | Chih-Cheng Lee, Chun-Chen Chen, Cheng-Yuan Chen | 2023-09-19 |
| 11756904 | Semiconductor device package and method of manufacturing the same | Yuanhao Yu, Yu-Lin Shih, Shih-Chun Li | 2023-09-12 |
| 11713843 | Stand adjustment device | Pei-Chi Chu, Chi-Chia Huang, Wei-Ting Chen | 2023-08-01 |
| 11680680 | Multi-functional and extendable mounting stand and coupling joint thereof | Chi-Chia Huang | 2023-06-20 |
| 11600901 | Semiconductor device package and method of manufacturing the same | Chih-Cheng Lee, Chun-Chen Chen, Yuanhao Yu | 2023-03-07 |
| 11233022 | Electrical connection placement of semiconductor device package and method of manufacturing the same | Chih-Cheng Lee | 2022-01-25 |
| 11201386 | Semiconductor device package and method for manufacturing the same | Chih-Cheng Lee, Chun-Chen Chen, Yuanhao Yu | 2021-12-14 |
| 11101186 | Substrate structure having pad portions | Chih-Cheng Lee | 2021-08-24 |
| 11088061 | Substrate, semiconductor device package and method of manufacturing the same | Chih-Cheng Lee | 2021-08-10 |
| 11056435 | Semiconductor package with chamfered pads | Chung-Chieh Chang, Ya Fang Chan, Chih-Cheng Lee | 2021-07-06 |
| 11024555 | Semiconductor substrate, semiconductor package, and method for forming the same | Chih-Cheng Lee | 2021-06-01 |
| 11004779 | Semiconductor device package and a method of manufacturing the same | Po-Shu Peng, Chih-Cheng Lee | 2021-05-11 |
| 10937400 | Cable-driven beater mechanism for percussion instrument | Pei-Chi Chu, Wei-Ting Chen, Chi-Chia Huang | 2021-03-02 |
| 10886208 | Semiconductor device package, electronic assembly and method for manufacturing the same | Chih-Cheng Lee, Chun-Chen Chen, Chen Chen | 2021-01-05 |
| 10748843 | Semiconductor substrate including embedded component and method of manufacturing the same | Li-Chuan Tsai, Po-Shu Peng, Chih-Cheng Lee | 2020-08-18 |
| 10734704 | Antenna package and method of manufacturing the same | Chih-Cheng Lee | 2020-08-04 |
| 10665523 | Semiconductor substrate, semiconductor package, and method for forming the same | Chih-Cheng Lee | 2020-05-26 |
| 10636730 | Semiconductor package and semiconductor manufacturing process | Chih-Cheng Lee, Li-Chuan Tsai | 2020-04-28 |
| 10615109 | Substrate, semiconductor device package and method of manufacturing the same | Chih-Cheng Lee | 2020-04-07 |