Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388001 | Electronic package | Chih-Cheng Lee | 2025-08-12 |
| 11756904 | Semiconductor device package and method of manufacturing the same | Yuanhao Yu, Cheng-Lin Ho, Shih-Chun Li | 2023-09-12 |
| 11515270 | Semiconductor device package and method of manufacturing the same | Chih-Cheng Lee | 2022-11-29 |
| 11232993 | Semiconductor device package and method of manufacturing the same | Chih-Cheng Lee | 2022-01-25 |
| 11205628 | Semiconductor device package and method of manufacturing the same | Chih-Cheng Lee | 2021-12-21 |
| 11031274 | Semiconductor device packages and method for manufacturing the same | Chih-Cheng Lee | 2021-06-08 |
| 10354969 | Substrate structure, semiconductor package including the same, and method for manufacturing the same | Chih-Cheng Lee | 2019-07-16 |
| 10340212 | Semiconductor package structure having a heat dissipation structure | Chih-Cheng Lee | 2019-07-02 |
| 10332757 | Semiconductor device package having a multi-portion connection element | Chih-Cheng Lee | 2019-06-25 |
| 10270184 | Control module and multiple-antenna device having the same | Ming-Chia Lee, Hong-Fang Yan | 2019-04-23 |
| 10135115 | Integrated module having antenna | Kuan-Wei Lee, Yao-Yuan Chang, Tsung-Wen Chiu | 2018-11-20 |
| 10084228 | System of integrated module with antenna | Tsung-Wen Chiu, Yao-Yuan Chang, Chia-Hsien Wei, Kuan-Wei Lee | 2018-09-25 |
| 10079156 | Semiconductor package including dielectric layers defining via holes extending to component pads | Chih-Cheng Lee, Yuan-Chang Su, You-Lung Yen | 2018-09-18 |
| 9721799 | Semiconductor package with reduced via hole width and reduced pad patch and manufacturing method thereof | Chih-Cheng Lee | 2017-08-01 |
| 6950313 | Interface card fastener | — | 2005-09-27 |