| 12388001 |
Electronic package |
Chih-Cheng Lee |
2025-08-12 |
| 11756904 |
Semiconductor device package and method of manufacturing the same |
Yuanhao Yu, Cheng-Lin Ho, Shih-Chun Li |
2023-09-12 |
| 11515270 |
Semiconductor device package and method of manufacturing the same |
Chih-Cheng Lee |
2022-11-29 |
| 11232993 |
Semiconductor device package and method of manufacturing the same |
Chih-Cheng Lee |
2022-01-25 |
| 11205628 |
Semiconductor device package and method of manufacturing the same |
Chih-Cheng Lee |
2021-12-21 |
| 11031274 |
Semiconductor device packages and method for manufacturing the same |
Chih-Cheng Lee |
2021-06-08 |
| 10354969 |
Substrate structure, semiconductor package including the same, and method for manufacturing the same |
Chih-Cheng Lee |
2019-07-16 |
| 10340212 |
Semiconductor package structure having a heat dissipation structure |
Chih-Cheng Lee |
2019-07-02 |
| 10332757 |
Semiconductor device package having a multi-portion connection element |
Chih-Cheng Lee |
2019-06-25 |
| 10270184 |
Control module and multiple-antenna device having the same |
Ming-Chia Lee, Hong-Fang Yan |
2019-04-23 |
| 10135115 |
Integrated module having antenna |
Kuan-Wei Lee, Yao-Yuan Chang, Tsung-Wen Chiu |
2018-11-20 |
| 10084228 |
System of integrated module with antenna |
Tsung-Wen Chiu, Yao-Yuan Chang, Chia-Hsien Wei, Kuan-Wei Lee |
2018-09-25 |
| 10079156 |
Semiconductor package including dielectric layers defining via holes extending to component pads |
Chih-Cheng Lee, Yuan-Chang Su, You-Lung Yen |
2018-09-18 |
| 9721799 |
Semiconductor package with reduced via hole width and reduced pad patch and manufacturing method thereof |
Chih-Cheng Lee |
2017-08-01 |
| 6950313 |
Interface card fastener |
— |
2005-09-27 |