Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11398421 | Semiconductor substrate and method for manufacturing the same | Chun-Che Lee, Ming-Chiang Lee, Tien-Szu Chen, Chih-Cheng Lee, You-Lung Yen | 2022-07-26 |
| 10424547 | Semiconductor device package and a method of manufacturing the same | Chih-Cheng Lee | 2019-09-24 |
| 10325842 | Substrate for packaging a semiconductor device package and a method of manufacturing the same | Chih-Cheng Lee | 2019-06-18 |
| 10181438 | Semiconductor substrate mitigating bridging | Chun-Che Lee, Ming-Chiang Lee, Tien-Szu Chen, Chih-Cheng Lee, You-Lung Yen | 2019-01-15 |
| 10128198 | Double side via last method for double embedded patterned substrate | You-Lung Yen, Chih-Cheng Lee | 2018-11-13 |
| 10096542 | Substrate, semiconductor package structure and manufacturing process | Chih-Cheng Lee | 2018-10-09 |
| 10083902 | Semiconductor package structure and semiconductor process | Chih-Cheng Lee, Cheng-Lin Ho | 2018-09-25 |
| 10079156 | Semiconductor package including dielectric layers defining via holes extending to component pads | Chih-Cheng Lee, Yu-Lin Shih, You-Lung Yen | 2018-09-18 |
| 9659853 | Double side via last method for double embedded patterned substrate | You-Lung Yen, Chih-Cheng Lee | 2017-05-23 |
| 9583427 | Semiconductor substrate, semiconductor package structure and method of making the same | Chih-Cheng Lee, Cheng-Lin Ho, Chung-Ming Wu, You-Lung Yen | 2017-02-28 |
| 9564346 | Package carrier, semiconductor package, and process for fabricating same | Shih-Fu Huang, Chia-Cheng Chen | 2017-02-07 |
| 9501527 | Bloom filter construction method for use in a table join operation portion of processing a query to a distributed database | Naresh K. Chainani, Kiran K. Chinta, Liping Zhang | 2016-11-22 |
| 9420695 | Semiconductor package structure and semiconductor process | Chih-Cheng Lee, Cheng-Lin Ho | 2016-08-16 |
| 9406658 | Embedded component device and manufacturing methods thereof | Chun-Che Lee, Ming-Chiang Lee, Shih-Fu Huang | 2016-08-02 |
| 9373601 | Semiconductor substrate, semiconductor package structure and method of making the same | Chih-Cheng Lee, Cheng-Lin Ho, Chung-Ming Wu, You-Lung Yen | 2016-06-21 |
| 9372892 | Bloom filter construction method for use in a table join operation portion of processing a query to a distributed database | Naresh K. Chainani, Kiran K. Chinta, Liping Zhang | 2016-06-21 |
| 9196597 | Semiconductor package with single sided substrate design and manufacturing methods thereof | Shih-Fu Huang, Chia-Cheng Chen, Tzu-Hui Chen, Kuang-Hsiung Chen, Pao-Ming Hsieh +2 more | 2015-11-24 |
| 9165900 | Semiconductor package and process for fabricating same | Shih-Fu Huang, Chia-Cheng Chen, Chia-Hsiung Hsieh, Tzu-Hui Chen, Kuang-Hsiung Chen +1 more | 2015-10-20 |
| 9117697 | Semiconductor substrate and method for making the same | Chun-Che Lee, Wen-Chi Cheng, Guo-Cheng Liao, Yi Ding | 2015-08-25 |
| 8884424 | Semiconductor package with single sided substrate design and manufacturing methods thereof | Shih-Fu Huang, Chia-Cheng Chen, Tzu-Hui Chen, Kuang-Hsiung Chen, Pao-Ming Hsieh +2 more | 2014-11-11 |
| 8786062 | Semiconductor package and process for fabricating same | Shih-Fu Huang, Chia-Cheng Chen, Chia-Hsiung Hsieh, Tzu-Hui Chen, Kuang-Hsiung Chen +1 more | 2014-07-22 |
| 8569894 | Semiconductor package with single sided substrate design and manufacturing methods thereof | Shih-Fu Huang, Chia-Cheng Chen, Tzu-Hui Chen, Kuang-Hsiung Chen, Pao-Ming Hsieh +2 more | 2013-10-29 |
| 8399776 | Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package | Bernd Karl Appelt, William T. Chen, Calvin Chun Long CHEUNG, Shih-Fu Huang, Chia-Cheng Chen +1 more | 2013-03-19 |
| 8367473 | Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereof | Shih-Fu Huang, Chia-Cheng Chen, Ta-Chun Lee, Kuang-Hsiung Chen | 2013-02-05 |
| 8357861 | Circuit board, and chip package structure | Shih-Fu Huang, Chia-Hsiung Hsieh | 2013-01-22 |