Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8618677 | Wirebonded semiconductor package | — | 2013-12-31 |
| 8399776 | Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package | Bernd Karl Appelt, William T. Chen, Calvin Chun Long CHEUNG, Shih-Fu Huang, Yuan-Chang Su +1 more | 2013-03-19 |
| 8367473 | Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereof | Shih-Fu Huang, Yuan-Chang Su, Chia-Cheng Chen, Kuang-Hsiung Chen | 2013-02-05 |