| 11449310 |
Random number generator, encryption/decryption secret key generator and method based on characteristics of memory cells |
Cheng-Yu Chen, Yi-Lin Hsieh, Jing Xiao |
2022-09-20 |
| 11055023 |
Electronic device, related controller circuit and method |
Yi-Lin Hsieh, Cheng-Yu Chen |
2021-07-06 |
| 10956087 |
Memory controller having temperature dependent data program scheme and related method |
Cheng-Yu Chen |
2021-03-23 |
| 10705743 |
Memory control device, control method of flash memory, and method for generating security feature of flash memory |
Cheng-Yu Chen, Yi-Lin Hsieh, Jing Xiao |
2020-07-07 |
| 10672499 |
NAND flash memory controller and storage apparatus applying the same |
Shu-Min Lin, Jo-Hua Wu, Cheng-Yu Chen |
2020-06-02 |
| 10288258 |
Lighting module |
Wei-Jung Lee |
2019-05-14 |
| 9564346 |
Package carrier, semiconductor package, and process for fabricating same |
Yuan-Chang Su, Chia-Cheng Chen |
2017-02-07 |
| 9548138 |
Test method for memory |
Ying-Tsai Ting, Che-Chin Wu, Tsung-Yi Chou |
2017-01-17 |
| 9406658 |
Embedded component device and manufacturing methods thereof |
Chun-Che Lee, Yuan-Chang Su, Ming-Chiang Lee |
2016-08-02 |
| 9305638 |
Operation method for memory device |
Yu-Ming Chang, Yung-Chun Li, Chih-Chang Hsieh, Hsiang-Pang Li, Yuan-Hao Chang +1 more |
2016-04-05 |
| 9196597 |
Semiconductor package with single sided substrate design and manufacturing methods thereof |
Yuan-Chang Su, Chia-Cheng Chen, Tzu-Hui Chen, Kuang-Hsiung Chen, Pao-Ming Hsieh +2 more |
2015-11-24 |
| 9165900 |
Semiconductor package and process for fabricating same |
Yuan-Chang Su, Chia-Cheng Chen, Chia-Hsiung Hsieh, Tzu-Hui Chen, Kuang-Hsiung Chen +1 more |
2015-10-20 |
| 8945994 |
Single layer coreless substrate |
Dror Hurwitz |
2015-02-03 |
| 8884424 |
Semiconductor package with single sided substrate design and manufacturing methods thereof |
Yuan-Chang Su, Chia-Cheng Chen, Tzu-Hui Chen, Kuang-Hsiung Chen, Pao-Ming Hsieh +2 more |
2014-11-11 |
| 8866286 |
Single layer coreless substrate |
Dror Hurwitz, Xianming Chen Simon Chan |
2014-10-21 |
| 8786062 |
Semiconductor package and process for fabricating same |
Yuan-Chang Su, Chia-Cheng Chen, Chia-Hsiung Hsieh, Tzu-Hui Chen, Kuang-Hsiung Chen +1 more |
2014-07-22 |
| 8569894 |
Semiconductor package with single sided substrate design and manufacturing methods thereof |
Yuan-Chang Su, Chia-Cheng Chen, Tzu-Hui Chen, Kuang-Hsiung Chen, Pao-Ming Hsieh +2 more |
2013-10-29 |
| 8399776 |
Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package |
Bernd Karl Appelt, William T. Chen, Calvin Chun Long CHEUNG, Yuan-Chang Su, Chia-Cheng Chen +1 more |
2013-03-19 |
| 8367473 |
Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereof |
Yuan-Chang Su, Chia-Cheng Chen, Ta-Chun Lee, Kuang-Hsiung Chen |
2013-02-05 |
| 8357861 |
Circuit board, and chip package structure |
Yuan-Chang Su, Chia-Hsiung Hsieh |
2013-01-22 |
| 8330267 |
Semiconductor package |
Kuang-Hsiung Chen, Pao-Ming Hsieh, Yuan-Chang Su, Bernd Karl Appelt |
2012-12-11 |
| 8320134 |
Embedded component substrate and manufacturing methods thereof |
Yuan-Chang Su, Ming-Chiang Lee, Chien-Hao Wang |
2012-11-27 |
| 8288869 |
Semiconductor package with substrate having single metal layer and manufacturing methods thereof |
Yuan-Chang Su, Chia-Cheng Chen, Kuang-Hsiung Chen, Ming-Chiang Lee, Bernd Karl Appelt +1 more |
2012-10-16 |
| 8284561 |
Embedded component package structure |
Yuan-Chang Su, Bernd Karl Appelt, Ming-Chiang Lee |
2012-10-09 |