Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9165900 | Semiconductor package and process for fabricating same | Yuan-Chang Su, Shih-Fu Huang, Chia-Cheng Chen, Tzu-Hui Chen, Kuang-Hsiung Chen +1 more | 2015-10-20 |
| 8786062 | Semiconductor package and process for fabricating same | Yuan-Chang Su, Shih-Fu Huang, Chia-Cheng Chen, Tzu-Hui Chen, Kuang-Hsiung Chen +1 more | 2014-07-22 |
| 8357861 | Circuit board, and chip package structure | Shih-Fu Huang, Yuan-Chang Su | 2013-01-22 |
| 8288869 | Semiconductor package with substrate having single metal layer and manufacturing methods thereof | Shih-Fu Huang, Yuan-Chang Su, Chia-Cheng Chen, Kuang-Hsiung Chen, Ming-Chiang Lee +1 more | 2012-10-16 |