| 12218077 |
Semiconductor device package |
Cheng-Nan Lin, Yung-I Yeh |
2025-02-04 |
|
| 11398421 |
Semiconductor substrate and method for manufacturing the same |
Chun-Che Lee, Yuan-Chang Su, Tien-Szu Chen, Chih-Cheng Lee, You-Lung Yen |
2022-07-26 |
$1,044,000 |
| 10797022 |
Semiconductor device package and method of manufacturing the same |
Hsu-Nan FANG, Chun-Jun Zhuang, Yung-I Yeh |
2020-10-06 |
$980,000 |
| 10181438 |
Semiconductor substrate mitigating bridging |
Chun-Che Lee, Yuan-Chang Su, Tien-Szu Chen, Chih-Cheng Lee, You-Lung Yen |
2019-01-15 |
$2,012,000 |
| 9578737 |
Substrate structure and package structure using the same |
Kuo-Hua Chen, Tsung-Hsun Lee, Chen-Chuan Fan |
2017-02-21 |
$3,165,000 |
| 9406658 |
Embedded component device and manufacturing methods thereof |
Chun-Che Lee, Yuan-Chang Su, Shih-Fu Huang |
2016-08-02 |
$3,647,000 |
| 9196597 |
Semiconductor package with single sided substrate design and manufacturing methods thereof |
Yuan-Chang Su, Shih-Fu Huang, Chia-Cheng Chen, Tzu-Hui Chen, Kuang-Hsiung Chen +2 more |
2015-11-24 |
$2,672,000 |
| 9190367 |
Semiconductor package structure and semiconductor process |
Kuo-Hsien Liao, Cheng-Nan Lin |
2015-11-17 |
$5,591,000 |
| 8884424 |
Semiconductor package with single sided substrate design and manufacturing methods thereof |
Yuan-Chang Su, Shih-Fu Huang, Chia-Cheng Chen, Tzu-Hui Chen, Kuang-Hsiung Chen +2 more |
2014-11-11 |
$1,802,000 |
| 8665605 |
Substrate structure and package structure using the same |
Kuo-Hua Chen, Tsung-Hsun Lee, Chen-Chuan Fan |
2014-03-04 |
$2,792,000 |
| 8569894 |
Semiconductor package with single sided substrate design and manufacturing methods thereof |
Yuan-Chang Su, Shih-Fu Huang, Chia-Cheng Chen, Tzu-Hui Chen, Kuang-Hsiung Chen +2 more |
2013-10-29 |
$1,593,000 |
| 8510940 |
Method of fabricating a multi-trace via substrate |
Min-Yao CHEN, Mao-Chang Chuang, Chien-Hao Wang |
2013-08-20 |
$2,594,000 |
| 8497585 |
Chip package |
— |
2013-07-30 |
$2,759,000 |
| 8487426 |
Semiconductor package with embedded die and manufacturing methods thereof |
Kay Stephan Essig, Bernd Karl Appelt |
2013-07-16 |
$1,264,000 |
| 8416577 |
Coreless substrate and method for making the same |
Chien-Hao Wang |
2013-04-09 |
$1,356,000 |
| 8387239 |
Manufacturing method of embedded circuit substrate |
Chien-Hao Wang |
2013-03-05 |
$706,000 |
| 8372689 |
Wafer-level semiconductor device packages with three-dimensional fan-out and manufacturing methods thereof |
Chien-Hao Wang |
2013-02-12 |
$1,314,000 |
| 8320134 |
Embedded component substrate and manufacturing methods thereof |
Yuan-Chang Su, Shih-Fu Huang, Chien-Hao Wang |
2012-11-27 |
$1,650,000 |
| 8288869 |
Semiconductor package with substrate having single metal layer and manufacturing methods thereof |
Shih-Fu Huang, Yuan-Chang Su, Chia-Cheng Chen, Kuang-Hsiung Chen, Bernd Karl Appelt +1 more |
2012-10-16 |
$520,000 |
| 8284561 |
Embedded component package structure |
Yuan-Chang Su, Shih-Fu Huang, Bernd Karl Appelt |
2012-10-09 |
$1,647,000 |
| 8104171 |
Method of fabricating multi-layered substrate |
Bernd Karl Appelt, Yuan-Chang Su, You-Lung Yen |
2012-01-31 |
$623,000 |
| 8059422 |
Thermally enhanced package structure |
Ho-Ming Tong, Shin-Hua Chao, Tai-Yuan Huang, Chao-Yuan Liu, Yung-Cheng Huang +3 more |
2011-11-15 |
$1,007,000 |
| 7993982 |
Quad flat non-leaded package and manufacturing method thereof |
— |
2011-08-09 |
$639,000 |
| 7706149 |
Micro-electro-mechanical-system package and method for manufacturing the same |
Hsueh-An Yang, Meng-Jen Wang, Wei-Chung Wang, Wei-Pin Huang, Feng Cheng |
2010-04-27 |
$2,239,000 |
| 7614888 |
Flip chip package process |
Ho-Ming Tong, Shin-Hua Chao, Tai-Yuan Huang, Chao-Yuan Liu, Yung-Cheng Huang +3 more |
2009-11-10 |
$1,306,000 |