Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12218077 | Semiconductor device package | Cheng-Nan Lin, Yung-I Yeh | 2025-02-04 |
| 11398421 | Semiconductor substrate and method for manufacturing the same | Chun-Che Lee, Yuan-Chang Su, Tien-Szu Chen, Chih-Cheng Lee, You-Lung Yen | 2022-07-26 |
| 10797022 | Semiconductor device package and method of manufacturing the same | Hsu-Nan FANG, Chun-Jun Zhuang, Yung-I Yeh | 2020-10-06 |
| 10181438 | Semiconductor substrate mitigating bridging | Chun-Che Lee, Yuan-Chang Su, Tien-Szu Chen, Chih-Cheng Lee, You-Lung Yen | 2019-01-15 |
| 9578737 | Substrate structure and package structure using the same | Kuo-Hua Chen, Tsung-Hsun Lee, Chen-Chuan Fan | 2017-02-21 |
| 9406658 | Embedded component device and manufacturing methods thereof | Chun-Che Lee, Yuan-Chang Su, Shih-Fu Huang | 2016-08-02 |
| 9196597 | Semiconductor package with single sided substrate design and manufacturing methods thereof | Yuan-Chang Su, Shih-Fu Huang, Chia-Cheng Chen, Tzu-Hui Chen, Kuang-Hsiung Chen +2 more | 2015-11-24 |
| 9190367 | Semiconductor package structure and semiconductor process | Kuo-Hsien Liao, Cheng-Nan Lin | 2015-11-17 |
| 8884424 | Semiconductor package with single sided substrate design and manufacturing methods thereof | Yuan-Chang Su, Shih-Fu Huang, Chia-Cheng Chen, Tzu-Hui Chen, Kuang-Hsiung Chen +2 more | 2014-11-11 |
| 8665605 | Substrate structure and package structure using the same | Kuo-Hua Chen, Tsung-Hsun Lee, Chen-Chuan Fan | 2014-03-04 |
| 8569894 | Semiconductor package with single sided substrate design and manufacturing methods thereof | Yuan-Chang Su, Shih-Fu Huang, Chia-Cheng Chen, Tzu-Hui Chen, Kuang-Hsiung Chen +2 more | 2013-10-29 |
| 8510940 | Method of fabricating a multi-trace via substrate | Min-Yao CHEN, Mao-Chang Chuang, Chien-Hao Wang | 2013-08-20 |
| 8497585 | Chip package | — | 2013-07-30 |
| 8487426 | Semiconductor package with embedded die and manufacturing methods thereof | Kay Stephan Essig, Bernd Karl Appelt | 2013-07-16 |
| 8416577 | Coreless substrate and method for making the same | Chien-Hao Wang | 2013-04-09 |
| 8387239 | Manufacturing method of embedded circuit substrate | Chien-Hao Wang | 2013-03-05 |
| 8372689 | Wafer-level semiconductor device packages with three-dimensional fan-out and manufacturing methods thereof | Chien-Hao Wang | 2013-02-12 |
| 8320134 | Embedded component substrate and manufacturing methods thereof | Yuan-Chang Su, Shih-Fu Huang, Chien-Hao Wang | 2012-11-27 |
| 8288869 | Semiconductor package with substrate having single metal layer and manufacturing methods thereof | Shih-Fu Huang, Yuan-Chang Su, Chia-Cheng Chen, Kuang-Hsiung Chen, Bernd Karl Appelt +1 more | 2012-10-16 |
| 8284561 | Embedded component package structure | Yuan-Chang Su, Shih-Fu Huang, Bernd Karl Appelt | 2012-10-09 |
| 8104171 | Method of fabricating multi-layered substrate | Bernd Karl Appelt, Yuan-Chang Su, You-Lung Yen | 2012-01-31 |
| 8059422 | Thermally enhanced package structure | Ho-Ming Tong, Shin-Hua Chao, Tai-Yuan Huang, Chao-Yuan Liu, Yung-Cheng Huang +3 more | 2011-11-15 |
| 7993982 | Quad flat non-leaded package and manufacturing method thereof | — | 2011-08-09 |
| 7706149 | Micro-electro-mechanical-system package and method for manufacturing the same | Hsueh-An Yang, Meng-Jen Wang, Wei-Chung Wang, Wei-Pin Huang, Feng Cheng | 2010-04-27 |
| 7614888 | Flip chip package process | Ho-Ming Tong, Shin-Hua Chao, Tai-Yuan Huang, Chao-Yuan Liu, Yung-Cheng Huang +3 more | 2009-11-10 |