Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315828 | Package substrate, electronic device package and method for manufacturing the same | Wu Chou Hsu, Chih-Cheng Lee, Hsing Kuo Tien | 2025-05-27 |
| 11997798 | Package substrate and method for manufacturing the same | Wu Chou Hsu, Hsing Kuo Tien, Chih-Cheng Lee | 2024-05-28 |
| 11432406 | Package substrate | Wu Chou Hsu, Hsing Kuo Tien, Chih-Cheng Lee | 2022-08-30 |
| 11342272 | Substrate structures, and methods for forming the same and semiconductor package structures | Wu Chou Hsu | 2022-05-24 |
| 11335650 | Package substrate, electronic device package and method for manufacturing the same | Wu Chou Hsu, Chih-Cheng Lee, Hsing Kuo Tien | 2022-05-17 |
| 11239184 | Package substrate, electronic device package and method for manufacturing the same | Wu Chou Hsu, Chih-Cheng Lee, Hsing Kuo Tien | 2022-02-01 |
| 8510940 | Method of fabricating a multi-trace via substrate | Mao-Chang Chuang, Ming-Chiang Lee, Chien-Hao Wang | 2013-08-20 |