Issued Patents All Time
Showing 25 most recent of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12364008 | Semiconductor device package and method of manufacturing the same | Ming-Hung Chen, Chang-Lin Yeh, Sheng-Yu Chen | 2025-07-15 |
| 12218077 | Semiconductor device package | Cheng-Nan Lin, Ming-Chiang Lee | 2025-02-04 |
| 12089349 | Semiconductor device package and method of manufacturing the same | Ming-Hung Chen, Chang-Lin Yeh, Sheng-Yu Chen | 2024-09-10 |
| 11997888 | Semiconductor device package and method of manufacturing the same | Ming-Hung Chen, Sheng-Yu Chen, Chang-Lin Yeh | 2024-05-28 |
| 11744024 | Semiconductor device package and method of manufacturing the same | Ming-Hung Chen, Chang-Lin Yeh, Sheng-Yu Chen | 2023-08-29 |
| 11437415 | Semiconductor device package and method of manufacturing the same | Ming-Hung Chen, Chang-Lin Yeh, Sheng-Yu Chen | 2022-09-06 |
| 11224132 | Semiconductor device package and method of manufacturing the same | Ming-Hung Chen, Chang-Lin Yeh, Sheng-Yu Chen | 2022-01-11 |
| 11201200 | Semiconductor device package and method of manufacturing the same | Ming-Hung Chen, Sheng-Yu Chen, Chang-Lin Yeh | 2021-12-14 |
| 11139252 | Semiconductor package and method for manufacturing the same | Hsu-Nan FANG, Chun-Jun Zhuang | 2021-10-05 |
| 11081473 | Semiconductor device package and method of manufacturing the same | Ming-Hung Chen, Sheng-Yu Chen, Chang-Lin Yeh | 2021-08-03 |
| 10797022 | Semiconductor device package and method of manufacturing the same | Hsu-Nan FANG, Chun-Jun Zhuang, Ming-Chiang Lee | 2020-10-06 |
| 10593630 | Semiconductor package and method for manufacturing the same | Hsu-Nan FANG, Chun-Jun Zhuang | 2020-03-17 |
| 9984983 | Semiconductor packages with thermal-enhanced conformal shielding and related methods | Chi-Sheng Chung, Kuo-Hsien Liao, Jin-Feng Yang, Chen-Yin Tai | 2018-05-29 |
| 9960137 | Semiconductor device package and method for forming the same | Chun-Chin Huang, Che-Ming Hsu | 2018-05-01 |
| 9484313 | Semiconductor packages with thermal-enhanced conformal shielding and related methods | Chi-Sheng Chung, Kuo-Hsien Liao, Jin-Feng Yang, Chen-Yin Tai | 2016-11-01 |
| 8786060 | Semiconductor package integrated with conformal shield and antenna | Han-Chee Yen, Chi-Sheng Chung, Kuo-Hsien Liao | 2014-07-22 |
| 7375020 | Method of forming bumps | Tsung-Hua Wu, Min-Lung Huang, Shih-Chang Lee, Jen-Kuang Fang | 2008-05-20 |
| 7061084 | Lead-bond type chip package and manufacturing method thereof | Kun-Ching Chen | 2006-06-13 |
| 6960822 | Solder mask and structure of a substrate | Yi Ding | 2005-11-01 |
| 6916732 | Method of forming bumps | Tsung-Hua Wu, Min-Lung Huang, Shih-Chang Lee, Jen-Kuang Fang | 2005-07-12 |
| 6795746 | System for providing IC bonding diagram via network | Chun-Min Chuang, I-Liang Lin, Chun-Kuang Lin | 2004-09-21 |
| 6751781 | Thermal data automatic service system | I-Liang Lin, Chun-Min Chuang | 2004-06-15 |
| 6642612 | Lead-bond type chip package and manufacturing method thereof | Kun-Ching Chen | 2003-11-04 |
| 6551855 | Substrate strip and manufacturing method thereof | Yi Ding, Kun-Ching Chen | 2003-04-22 |
| 6528882 | Thermal enhanced ball grid array package | Yi Ding, Chang-Chi Lee, Kun-Ching Chen | 2003-03-04 |