Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12249578 | Semiconductor package structure and method for manufacturing the same | — | 2025-03-11 |
| 12165982 | Semiconductor package structure and method for manufacturing the same | Chun-Jun Zhuang | 2024-12-10 |
| 12142576 | Semiconductor package structure and method for manufacturing the same | Chun-Jun Zhuang | 2024-11-12 |
| 12136579 | Package structure and method for manufacturing the same | — | 2024-11-05 |
| 11791434 | Electronic package, optoelectronic package and method of manufacturing the same | Jun-Wei Chen, Yu-Yuan Yeh | 2023-10-17 |
| 11710675 | Package structure and method for manufacturing the same | — | 2023-07-25 |
| 11605597 | Semiconductor package structure and method for manufacturing the same | Chun-Jun Zhuang | 2023-03-14 |
| 11538778 | Semiconductor package including alignment material and method for manufacturing semiconductor package | — | 2022-12-27 |
| 11502024 | Semiconductor device package and method of manufacturing the same | — | 2022-11-15 |
| 11404380 | Semiconductor package structure and method for manufacturing the same | Chun-Jun Zhuang | 2022-08-02 |
| 11316274 | Semiconductor device package and method of manufacturing the same | Cheng-Nan Lin | 2022-04-26 |
| 11282778 | Interposer between a conductive substrate and plurality of semiconductor components | — | 2022-03-22 |
| 11282772 | Package structure, assembly structure and method for manufacturing the same | — | 2022-03-22 |
| 11276661 | Package structure including two joint structures including different materials and method for manufacturing the same | — | 2022-03-15 |
| 11257776 | Semiconductor package structure and method for manufacturing the same | Yung-Sheng Lin, Chin-Li KAO | 2022-02-22 |
| 11257788 | Semiconductor device package with stacked die having traces on lateral surface | Chun-Jun Zhuang | 2022-02-22 |
| 11217498 | Semiconductor package and manufacturing method of the same | Chien-Ching CHEN, Chen Yuan Weng | 2022-01-04 |
| 11211319 | Device structure | Chun-Jun Zhuang, Chen Yuan Weng | 2021-12-28 |
| 11195771 | Substrate structure of semiconductor device package and method of manufacturing the same | — | 2021-12-07 |
| 11139252 | Semiconductor package and method for manufacturing the same | Chun-Jun Zhuang, Yung-I Yeh | 2021-10-05 |
| 11139268 | Semiconductor package structure and method of manufacturing the same | — | 2021-10-05 |
| 11133284 | Semiconductor package device | Jen-Hsien Wong | 2021-09-28 |
| 10943843 | Semiconductor package structure | Hsiu-Chi Liu | 2021-03-09 |
| 10886223 | Semiconductor package | Chun-Jun Zhuang | 2021-01-05 |
| 10804172 | Semiconductor package device with thermal conducting material for heat dissipation | — | 2020-10-13 |