Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374631 | Semiconductor device package and method of manufacturing the same | Hsu-Chiang Shih, Hung-Yi Lin, Meng-Wei Hsieh, Yu-Sheng Chang, Mark A. Gerber | 2025-07-29 |
| 11798858 | Semiconductor package structure including reinforcement component and method for manufacturing the same | Meng-Wei Hsieh | 2023-10-24 |
| 11342282 | Semiconductor device package including a reinforcement structure on an electronic component and method of manufacturing the same | Hsu-Chiang Shih, Hung-Yi Lin, Meng-Wei Hsieh, Yu-Sheng Chang, Mark A. Gerber | 2022-05-24 |
| 11094649 | Semiconductor package structure and method for manufacturing the same | Fan-Yu MIN, Chen-Hung LEE, Liang Chen | 2021-08-17 |
| 10943843 | Semiconductor package structure | Hsu-Nan FANG | 2021-03-09 |