Issued Patents All Time
Showing 1–25 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431365 | Bump structure and method of making the same | Wen-Hsiung Lu, Ming-Da Cheng, Su-Fei Lin, Hsu-Lun Liu, Chien-Pin Chan | 2025-09-30 |
| 12412858 | Semiconductor device structure with conductive bumps | Hui-Min Huang, Ming-Da Cheng, Wei-Hung Lin, Chang-Jung Hsueh, Kai Jun Zhan | 2025-09-09 |
| 12333314 | Systems and methods for configuration of a workspace based on short-range wireless location mapping in heterogeneous computing platforms | Daniel L. Hamlin, Todd Erick Swierk, Srikanth Kondapi, Hariprasad Janardana Iyer | 2025-06-17 |
| 12141519 | Systems and methods for managing text settings based upon user distance with heterogeneous computing platforms | Hariprasad Janardana Iyer, Daniel L. Hamlin, Todd Erick Swierk, Srikanth Kondapi | 2024-11-12 |
| 12109669 | Pipe plier structure | Shih-Liang Huang | 2024-10-08 |
| 12064754 | Titanium catalyst and synthesizing polyester resins | Yi-Chou Tsai, John Di-Yi Ou, Chuan-Sheng Huang | 2024-08-20 |
| 12057670 | Semiconductor package structure and method for manufacturing the same | An-Hsuan HSU | 2024-08-06 |
| 12033870 | Bump structure and method of making the same | Wen-Hsiung Lu, Ming-Da Cheng, Su-Fei Lin, Hsu-Lun Liu, Chien-Pin Chan | 2024-07-09 |
| 12015002 | Chip structure and method for forming the same | Hui-Min Huang, Ming-Da Cheng, Wei-Hung Lin, Chang-Jung Hsueh, Kai Jun Zhan | 2024-06-18 |
| 12009256 | Redistribution lines with protection layers and method forming same | Ming-Da Cheng, Wen-Hsiung Lu, Chin Wei Kang, Yung-Han Chuang, Lung-Kai Mao | 2024-06-11 |
| 11994787 | Method and apparatus for closed-loop camera shutter control and remediation hardware | Geroncio O. Tan, Daniel L. Hamlin, Yao-Hsien Huang | 2024-05-28 |
| 11990440 | Structure and formation method of semiconductor device with conductive bumps | Hui-Min Huang, Ming-Da Cheng, Wei-Hung Lin, Chang-Jung Hsueh, Kai Jun Zhan | 2024-05-21 |
| 11854964 | Structure and formation method of semiconductor device with conductive bumps | Ming-Da Cheng, Wei-Hung Lin, Hui-Min Huang, Chang-Jung Hsueh, Po-Hao Tsai | 2023-12-26 |
| 11798907 | Semiconductor packages | Yun-Ching HUNG, An-Hsuan HSU, Chung-Hung LAI | 2023-10-24 |
| 11769716 | Semiconductor device and methods of forming the same | Cheng-Lung Yang, Chin-Yu Ku, Ming-Da Cheng, Wen-Hsiung Lu, Tang-Wei Huang +1 more | 2023-09-26 |
| 11721579 | Redistribution lines with protection layers and method forming same | Ming-Da Cheng, Wen-Hsiung Lu, Chin Wei Kang, Yung-Han Chuang, Lung-Kai Mao | 2023-08-08 |
| 11669639 | System and method for multi-user state change | Vivek Viswanathan Iyer, Daniel L. Hamlin | 2023-06-06 |
| 11430761 | Semiconductor package and method for manufacturing the same | Yun-Ching HUNG, Chin-Li KAO | 2022-08-30 |
| 11417539 | Bump structure and method of making the same | Wen-Hsiung Lu, Ming-Da Cheng, Su-Fei Lin, Hsu-Lun Liu, Chien-Pin Chan | 2022-08-16 |
| 11387143 | Redistribution lines with protection layers and method forming same | Ming-Da Cheng, Wen-Hsiung Lu, Chin Wei Kang, Yung-Han Chuang, Lung-Kai Mao | 2022-07-12 |
| 11257776 | Semiconductor package structure and method for manufacturing the same | Chin-Li KAO, Hsu-Nan FANG | 2022-02-22 |
| 11180607 | Polyesters with ultra-high flowability and superior stability and meltblown fibers thereof | Bo Xue, Tsai-Pang Huang | 2021-11-23 |
| 11065724 | Laser weldable compositions, products and uses thereof | Te-Shun Lin, Cheng-Hsiang Hung, Hsin-Hsien Tsai, Po-Yuan Cheng, Kuen-Yuan Hwang +1 more | 2021-07-20 |
| 10745556 | Amino resin composition and varnish, coating layer, and product comprising the same | Ren-Wei Tsai, You-Ting Chen, Kuo-Pin Wu, I-Chiang Lai, Yi-Sern Wong +1 more | 2020-08-18 |
| 10450478 | Epoxy resin, aqueous dispersion and water-borne epoxy coating composition comprising the same | Ying Lin, Liang Liu, I-Chiang Lai, Yi-Sern Wong, Kuen-Yuan Hwang | 2019-10-22 |