Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431365 | Bump structure and method of making the same | Wen-Hsiung Lu, Ming-Da Cheng, Su-Fei Lin, Chien-Pin Chan, Yung-Sheng Lin | 2025-09-30 |
| 12300580 | Semiconductor device and method | Wen-Hsiung Lu, Ming-Da Cheng, Chen-En Yen, Cheng-Lung Yang, Kuanchih Huang | 2025-05-13 |
| 12255166 | Semiconductor package structure comprising via structure and redistribution layer structure | Neng-Chieh CHANG, Po-Hao Tsai, Ming-Da Cheng, Wen-Hsiung Lu | 2025-03-18 |
| 12040256 | Semiconductor device and method | Wen-Hsiung Lu, Ming-Da Cheng, Chen-En Yen, Cheng-Lung Yang, Kuanchih Huang | 2024-07-16 |
| 12033870 | Bump structure and method of making the same | Wen-Hsiung Lu, Ming-Da Cheng, Su-Fei Lin, Chien-Pin Chan, Yung-Sheng Lin | 2024-07-09 |
| 11817413 | Semiconductor package structure comprising via structure and redistribution layer structure and method for forming the same | Neng-Chieh CHANG, Po-Hao Tsai, Ming-Da Cheng, Wen-Hsiung Lu | 2023-11-14 |
| 11776881 | Semiconductor device and method | Wen-Hsiung Lu, Ming-Da Cheng, Chen-En Yen, Cheng-Lung Yang, Kuanchih Huang | 2023-10-03 |
| 11594508 | Redistribution lines having nano columns and method forming same | Po-Hao Tsai, Ming-Da Cheng, Wen-Hsiung Lu, Kai-Di Wu, Su-Fei Lin | 2023-02-28 |
| 11417539 | Bump structure and method of making the same | Wen-Hsiung Lu, Ming-Da Cheng, Su-Fei Lin, Chien-Pin Chan, Yung-Sheng Lin | 2022-08-16 |
| 11289404 | Semiconductor device and method | Wen-Hsiung Lu, Ming-Da Cheng, Chen-En Yen, Cheng-Lung Yang, Kuanchih Huang | 2022-03-29 |
| 11177137 | Wafer etching process and methods thereof | Wen-Hsiung Lu, Hui-Min Huang, Ming-Da Cheng, Wei-Hung Lin, Chen-En Yen | 2021-11-16 |