Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431365 | Bump structure and method of making the same | Wen-Hsiung Lu, Ming-Da Cheng, Hsu-Lun Liu, Chien-Pin Chan, Yung-Sheng Lin | 2025-09-30 |
| 12033870 | Bump structure and method of making the same | Wen-Hsiung Lu, Ming-Da Cheng, Hsu-Lun Liu, Chien-Pin Chan, Yung-Sheng Lin | 2024-07-09 |
| 11594508 | Redistribution lines having nano columns and method forming same | Po-Hao Tsai, Ming-Da Cheng, Wen-Hsiung Lu, Hsu-Lun Liu, Kai-Di Wu | 2023-02-28 |
| 11417539 | Bump structure and method of making the same | Wen-Hsiung Lu, Ming-Da Cheng, Hsu-Lun Liu, Chien-Pin Chan, Yung-Sheng Lin | 2022-08-16 |