Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8720053 | Process of fabricating a circuit board | Shih-Chang Lee, Ming-Loung Lu, Chun-Che Lee | 2014-05-13 |
| 7125745 | Multi-chip package substrate for flip-chip and wire bonding | Yi Ding, Po-Jen Cheng, Chih-Ming Chung, Yun-Hsiang Tien | 2006-10-24 |
| 7061347 | High frequency substrate comprised of dielectric layers of different dielectric coefficients | Sung-Mao Wu | 2006-06-13 |
| 7061084 | Lead-bond type chip package and manufacturing method thereof | Yung-I Yeh | 2006-06-13 |
| 6750397 | Thermally enhanced semiconductor build-up package | In-De Ou, Yi Ding | 2004-06-15 |
| 6737300 | Chip scale package and manufacturing method | Yi Ding, Xin Lee | 2004-05-18 |
| 6714421 | Flip chip package substrate | Ho-Ming Tong, Chun-Chi Lee | 2004-03-30 |
| 6701614 | Method for making a build-up package of a semiconductor | Yi Ding, In-De Ou | 2004-03-09 |
| 6680529 | Semiconductor build-up package | Yi Ding, In-De Ou | 2004-01-20 |
| 6642612 | Lead-bond type chip package and manufacturing method thereof | Yung-I Yeh | 2003-11-04 |
| 6551855 | Substrate strip and manufacturing method thereof | Yi Ding, Yung-I Yeh | 2003-04-22 |
| 6534852 | Ball grid array semiconductor package with improved strength and electric performance and method for making the same | Chun-Hung Lin, I Lee, Su Tao | 2003-03-18 |
| 6528882 | Thermal enhanced ball grid array package | Yi Ding, Chang-Chi Lee, Yung-I Yeh | 2003-03-04 |
| 6455941 | Chip scale package | Xin Lee, Yi Ding | 2002-09-24 |
| 6423622 | Lead-bond type chip package and manufacturing method thereof | Yung-I Yeh | 2002-07-23 |
| 6313413 | Wire structure of substrate for layout detection | Yire-Zine Lee, Yung-I Yeh, Su Tao | 2001-11-06 |
| 6252309 | Packaged semiconductor substrate | Wu Wang, Yung-I Yeh, Shyh-Ing Wu | 2001-06-26 |
| 6191360 | Thermally enhanced BGA package | Su Tao, Han-Hsiang Huang, Chun-Chi Lee | 2001-02-20 |
| 6190529 | Method for plating gold to bond leads on a semiconductor substrate | Yei-Shen Wu, Su Tao | 2001-02-20 |
| 5982625 | Semiconductor packaging device | Tao-Yu Chen, Yung-I Yeh, Wu Wang, Chun-Che Lee, Chun-Hsiung Huang +1 more | 1999-11-09 |