KC

Kun-Ching Chen

AE Advanced Semiconductor Engineering: 20 patents #46 of 1,073Top 5%
Overall (All Time): #224,420 of 4,157,543Top 6%
20
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8720053 Process of fabricating a circuit board Shih-Chang Lee, Ming-Loung Lu, Chun-Che Lee 2014-05-13
7125745 Multi-chip package substrate for flip-chip and wire bonding Yi Ding, Po-Jen Cheng, Chih-Ming Chung, Yun-Hsiang Tien 2006-10-24
7061347 High frequency substrate comprised of dielectric layers of different dielectric coefficients Sung-Mao Wu 2006-06-13
7061084 Lead-bond type chip package and manufacturing method thereof Yung-I Yeh 2006-06-13
6750397 Thermally enhanced semiconductor build-up package In-De Ou, Yi Ding 2004-06-15
6737300 Chip scale package and manufacturing method Yi Ding, Xin Lee 2004-05-18
6714421 Flip chip package substrate Ho-Ming Tong, Chun-Chi Lee 2004-03-30
6701614 Method for making a build-up package of a semiconductor Yi Ding, In-De Ou 2004-03-09
6680529 Semiconductor build-up package Yi Ding, In-De Ou 2004-01-20
6642612 Lead-bond type chip package and manufacturing method thereof Yung-I Yeh 2003-11-04
6551855 Substrate strip and manufacturing method thereof Yi Ding, Yung-I Yeh 2003-04-22
6534852 Ball grid array semiconductor package with improved strength and electric performance and method for making the same Chun-Hung Lin, I Lee, Su Tao 2003-03-18
6528882 Thermal enhanced ball grid array package Yi Ding, Chang-Chi Lee, Yung-I Yeh 2003-03-04
6455941 Chip scale package Xin Lee, Yi Ding 2002-09-24
6423622 Lead-bond type chip package and manufacturing method thereof Yung-I Yeh 2002-07-23
6313413 Wire structure of substrate for layout detection Yire-Zine Lee, Yung-I Yeh, Su Tao 2001-11-06
6252309 Packaged semiconductor substrate Wu Wang, Yung-I Yeh, Shyh-Ing Wu 2001-06-26
6191360 Thermally enhanced BGA package Su Tao, Han-Hsiang Huang, Chun-Chi Lee 2001-02-20
6190529 Method for plating gold to bond leads on a semiconductor substrate Yei-Shen Wu, Su Tao 2001-02-20
5982625 Semiconductor packaging device Tao-Yu Chen, Yung-I Yeh, Wu Wang, Chun-Che Lee, Chun-Hsiung Huang +1 more 1999-11-09