Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7727878 | Method for forming passivation layer | Cheng-Hsueh Su, Hsing-Fu Lu, Tsung-Chieh Ho | 2010-06-01 |
| 7651937 | Bumping process and structure thereof | Chueh-An Hsieh, Li-Cheng Tai, Shih-Kuang Chen | 2010-01-26 |
| 7518241 | Wafer structure with a multi-layer barrier in an UBM layer network device with power supply | Li-Cheng Tai, Jui-I Yu, Jiunn Chen, Chueh-An Hsieh, Shih-Kuang Chen +2 more | 2009-04-14 |
| 6918178 | Method of attaching a heat sink to an IC package | Shin-Hua Chao, Kuan-Neng Liao, Gin-Nan Yeh | 2005-07-19 |
| 6692581 | Solder paste for fabricating bump | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Ching-Fu Horng, Shih-Kuang Chen +5 more | 2004-02-17 |
| 6429049 | Laser method for forming vias | Chun-Chi Lee, Jaw-Shiun Hsieh, Yao-Hsin Feng, Kuan-Neng Liao, Chin-Pei Tien | 2002-08-06 |
| 6355499 | Method of making ball grid array package | Shin-Hua Chao, Yao-Shin Fang | 2002-03-12 |
| 6252309 | Packaged semiconductor substrate | Wu Wang, Yung-I Yeh, Kun-Ching Chen | 2001-06-26 |
| 5982625 | Semiconductor packaging device | Kun-Ching Chen, Tao-Yu Chen, Yung-I Yeh, Wu Wang, Chun-Che Lee +1 more | 1999-11-09 |