Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6918178 | Method of attaching a heat sink to an IC package | Shin-Hua Chao, Shyh-Ing Wu, Gin-Nan Yeh | 2005-07-19 |
| 6624523 | Structure and package of a heat spreader substrate | Shin-Hua Chao | 2003-09-23 |
| 6483187 | Heat-spread substrate | Shin-Hua Chao, Yao-Hsin Feng, Hou-Chang Kuo | 2002-11-19 |
| 6429049 | Laser method for forming vias | Chun-Chi Lee, Jaw-Shiun Hsieh, Yao-Hsin Feng, Shyh-Ing Wu, Chin-Pei Tien | 2002-08-06 |