Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6429049 | Laser method for forming vias | Chun-Chi Lee, Yao-Hsin Feng, Shyh-Ing Wu, Kuan-Neng Liao, Chin-Pei Tien | 2002-08-06 |
| 6244499 | Structure of a ball bump for wire bonding and the formation thereof | Yu-Fang Tsai | 2001-06-12 |