Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867899 | Semiconductor packages | Yuan-Fu Sung, Ming-Chi Liu, Hung-Sheng Chen | 2020-12-15 |
| 10141252 | Semiconductor packages | Yuan-Fu Sung, Ming-Chi Liu, Hung-Sheng Chen | 2018-11-27 |
| 8889488 | Method for manufacturing semiconductor package | Chao-Yuan Liu, Hui-Ying Hsieh, Chih-Ming Chung | 2014-11-18 |
| 8546950 | Semiconductor package and manufacturing method thereof | Chao-Yuan Liu, Hui-Ying Hsieh, Chih-Ming Chung | 2013-10-01 |
| 8059422 | Thermally enhanced package structure | Ho-Ming Tong, Ming-Chiang Lee, Tai-Yuan Huang, Chao-Yuan Liu, Yung-Cheng Huang +3 more | 2011-11-15 |
| 7614888 | Flip chip package process | Ho-Ming Tong, Ming-Chiang Lee, Tai-Yuan Huang, Chao-Yuan Liu, Yung-Cheng Huang +3 more | 2009-11-10 |
| 7445944 | Packaging substrate and manufacturing method thereof | Ho-Ming Tong, Teck-Chong Lee, Chao-Fu Weng, Chian-Chi Lin, Che-Ya Chou +2 more | 2008-11-04 |
| 7151317 | Multi-chip package structure | Jian-Wen Lo | 2006-12-19 |
| 7060595 | Circuit substrate and fabrication method thereof | In-De Ou, Chih-Pin Hung, Chia-Shang Chen, Kuang-Hua Lin | 2006-06-13 |
| 7041534 | Semiconductor chip package and method for making the same | Jen-Kuang Fang, Ho-Ming Tong | 2006-05-09 |
| 6918178 | Method of attaching a heat sink to an IC package | Shyh-Ing Wu, Kuan-Neng Liao, Gin-Nan Yeh | 2005-07-19 |
| 6624523 | Structure and package of a heat spreader substrate | Kuan-Neng Liao | 2003-09-23 |
| 6573123 | Semiconductor chip package and manufacturing method thereof | Sai LI, Chun-Hung Lin, Su Tao | 2003-06-03 |
| 6483187 | Heat-spread substrate | Kuan-Neng Liao, Yao-Hsin Feng, Hou-Chang Kuo | 2002-11-19 |
| 6355499 | Method of making ball grid array package | Shyh-Ing Wu, Yao-Shin Fang | 2002-03-12 |
| 6348729 | Semiconductor chip package and manufacturing method thereof | Sai LI, Chun-Hung Lin, Su Tao | 2002-02-19 |
| 6229702 | Ball grid array semiconductor package having improved heat dissipation efficiency, overall electrical performance and enhanced bonding capability | Su Tao, Chin-Long Wu, Tai-Chun Huang, Han-Hsiang Huang, Shih-Kuang Chen | 2001-05-08 |