Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8288853 | Three-dimensional package and method of making the same | Min-Lung Huang, Wei-Chung Wang, Po-Jen Cheng, Kuo-Chung Yee, Ching-Huei Su +1 more | 2012-10-16 |
| 7945062 | Microelectromechanical microphone packaging system | Wei-Chung Wang, Sung-Mao Wu, Hsueh-An Yang, Kuo-Pin Yang | 2011-05-17 |
| 7790505 | Semiconductor chip package manufacturing method and structure thereof | Chih-Huang Chang, Yueh-Lung Lin | 2010-09-07 |
| 7741152 | Three-dimensional package and method of making the same | Min-Lung Huang, Wei-Chung Wang, Po-Jen Cheng, Kuo-Chung Yee, Ching-Huei Su +1 more | 2010-06-22 |
| 7642132 | Three-dimensional package and method of making the same | Min-Lung Huang, Wei-Chung Wang, Po-Jen Cheng, Kuo-Chung Yee, Ching-Huei Su +1 more | 2010-01-05 |
| 7581666 | Wire-bonding method for wire-bonding apparatus | Ho-Ming Tong, Teck-Chong Lee, Chao-Fu Weng, Chih-Nan Wei, Song-Fu Yang +2 more | 2009-09-01 |
| 7547575 | Two-stage die-bonding method for simultaneous die-bonding of multiple dies | Ho-Ming Tong, Kao-Ming Su, Chao-Fu Weng, Teck-Chong Lee, Chia-Jung Tsai +2 more | 2009-06-16 |
| 7528053 | Three-dimensional package and method of making the same | Min-Lung Huang, Wei-Chung Wang, Po-Jen Cheng, Kuo-Chung Yee, Ching-Huei Su +1 more | 2009-05-05 |
| 7445944 | Packaging substrate and manufacturing method thereof | Ho-Ming Tong, Teck-Chong Lee, Chao-Fu Weng, Che-Ya Chou, Shin-Hua Chao +2 more | 2008-11-04 |
| 7446404 | Three-dimensional package and method of making the same | Min-Lung Huang, Wei-Chung Wang, Po-Jen Cheng, Kuo-Chung Yee, Ching-Huei Su +1 more | 2008-11-04 |
| 7223683 | Wafer level bumping process | — | 2007-05-29 |
| 7221041 | Multi-chips module package and manufacturing method thereof | Chih-Huang Chang | 2007-05-22 |
| 7045391 | Multi-chips bumpless assembly package and manufacturing method thereof | — | 2006-05-16 |
| 7002805 | Thermal enhance MCM package and manufacturing method thereof | Shih-Chang Lee, Su Tao | 2006-02-21 |