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2016-03-01 |
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Microelectromechanical microphone packaging system |
Wei-Chung Wang, Hsueh-An Yang, Kuo-Pin Yang, Chian-Chi Lin |
2011-05-17 |
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Semiconductor package structure with microstrip antennan |
— |
2008-04-01 |
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Inductor and capacitor formed of build-up vias |
Chi-Tsung Chiu, Chih-Pin Hung |
2007-07-24 |
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Integrated capacitor on packaging substrate |
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2007-04-03 |
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Impedance standard substrate and method for calibrating vector network analyzer |
Chi-Tsung Chiu |
2006-08-01 |
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Impedance standard substrate and correction method for vector network analyzer |
Chi-Tsung Chiu |
2006-07-04 |
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High frequency substrate comprised of dielectric layers of different dielectric coefficients |
Kun-Ching Chen |
2006-06-13 |
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Impedance standard substrate and method for calibrating vector network analyzer |
Chi-Tsung Chiu |
2006-05-30 |
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Semiconductor package |
Su Tao, Chi-Tsung Chiu |
2005-08-23 |