Hsueh-An Yang — 19 Patents at Advanced Semiconductor Engineering

Hsueh-An Yang has been granted 19 US patents while listed as an inventor at Advanced Semiconductor Engineering. The first was granted in 2007 and the most recent in November 2016. Hsueh-An Yang ranks #229,345 of 4,157,543 US inventors in our database (top 5.5%). Patent records list Hsueh-An Yang in Taipei, TW.

Issued Patents All Time

Showing 1–19 of 19 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
9502334	Method of making a semiconductor device package with dummy gate	—	2016-11-22	$1,913,000
9240348	Method of making a semiconductor device package	—	2016-01-19	$6,010,000
9056766	Method of forming a bond ring for a first and second substrate	Chun-Wen Cheng	2015-06-16	$4,675,000
8836116	Wafer level packaging of micro-electro-mechanical systems (MEMS) and complementary metal-oxide-semiconductor (CMOS) substrates	—	2014-09-16	$3,239,000
8810027	Bond ring for a first and second substrate	Chun-Wen Cheng	2014-08-19	$3,192,000
8633554	MEMS device etch stop	Chia-Hua Chu, Yi Heng Tsai, Kai-Chih Liang, Chia-Pao Shu, Li-Cheng Chu +2 more	2014-01-21	$7,674,000
8368152	MEMS device etch stop	Chia-Hua Chu, Yi Heng Tsai, Kai-Chih Liang, Chia-Pao Shu, Li-Cheng Chu +2 more	2013-02-05	$4,408,000
8318511	Integration manufacturing process for MEMS device	Mingching Wu, Hung-Yi Lin, Weileun Fang	2012-11-27
8277667	Magnetic element and manufacturing method therefor	Weileun Fang, Tsung Lin Tang	2012-10-02
8263493	Silicon chip having through via and method for making the same	Pei-Chun Chen, Chien-Hua Chen	2012-09-11	$1,662,000
8114699	Integration manufacturing process for MEMS device	Migching Wu, Hung-Yi Lin, Weileun Fang	2012-02-14
8030111	Integration manufacturing process for MEMS device	Mingching Wu, Hung-Yi Lin, Weileun Fang	2011-10-04
7945062	Microelectromechanical microphone packaging system	Wei-Chung Wang, Sung-Mao Wu, Kuo-Pin Yang, Chian-Chi Lin	2011-05-17	$487,000
7863181	Method for manufacturing a device having a high aspect ratio via	Po-Jen Cheng	2011-01-04	$1,839,000
7706149	Micro-electro-mechanical-system package and method for manufacturing the same	Meng-Jen Wang, Wei-Chung Wang, Ming-Chiang Lee, Wei-Pin Huang, Feng Cheng	2010-04-27	$2,239,000
7681779	Method for manufacturing electric connections in wafer	—	2010-03-23	$1,140,000
7651888	Wafer lever fixture and method for packaging micro-electro-mechanical-system devices	—	2010-01-26	$1,133,000
7501342	Device having high aspect-ratio via structure in low-dielectric material and method for manufacturing the same	Wei-Chung Wang, Po-Jen Cheng, Pei-Chun Chen	2009-03-10	$536,000
7196449	Two-axis device and manufacturing method therefor	Mingching Wu, Hung-Yi Lin, Weileun Fang	2007-03-27

Hsueh-An Yang — 19 Patents

Issued Patents All Time

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