Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502334 | Method of making a semiconductor device package with dummy gate | — | 2016-11-22 |
| 9240348 | Method of making a semiconductor device package | — | 2016-01-19 |
| 9056766 | Method of forming a bond ring for a first and second substrate | Chun-Wen Cheng | 2015-06-16 |
| 8836116 | Wafer level packaging of micro-electro-mechanical systems (MEMS) and complementary metal-oxide-semiconductor (CMOS) substrates | — | 2014-09-16 |
| 8810027 | Bond ring for a first and second substrate | Chun-Wen Cheng | 2014-08-19 |
| 8633554 | MEMS device etch stop | Chia-Hua Chu, Yi Heng Tsai, Kai-Chih Liang, Chia-Pao Shu, Li-Cheng Chu +2 more | 2014-01-21 |
| 8368152 | MEMS device etch stop | Chia-Hua Chu, Yi Heng Tsai, Kai-Chih Liang, Chia-Pao Shu, Li-Cheng Chu +2 more | 2013-02-05 |
| 8318511 | Integration manufacturing process for MEMS device | Mingching Wu, Hung-Yi Lin, Weileun Fang | 2012-11-27 |
| 8277667 | Magnetic element and manufacturing method therefor | Weileun Fang, Tsung Lin Tang | 2012-10-02 |
| 8263493 | Silicon chip having through via and method for making the same | Pei-Chun Chen, Chien-Hua Chen | 2012-09-11 |
| 8114699 | Integration manufacturing process for MEMS device | Migching Wu, Hung-Yi Lin, Weileun Fang | 2012-02-14 |
| 8030111 | Integration manufacturing process for MEMS device | Mingching Wu, Hung-Yi Lin, Weileun Fang | 2011-10-04 |
| 7945062 | Microelectromechanical microphone packaging system | Wei-Chung Wang, Sung-Mao Wu, Kuo-Pin Yang, Chian-Chi Lin | 2011-05-17 |
| 7863181 | Method for manufacturing a device having a high aspect ratio via | Po-Jen Cheng | 2011-01-04 |
| 7706149 | Micro-electro-mechanical-system package and method for manufacturing the same | Meng-Jen Wang, Wei-Chung Wang, Ming-Chiang Lee, Wei-Pin Huang, Feng Cheng | 2010-04-27 |
| 7681779 | Method for manufacturing electric connections in wafer | — | 2010-03-23 |
| 7651888 | Wafer lever fixture and method for packaging micro-electro-mechanical-system devices | — | 2010-01-26 |
| 7501342 | Device having high aspect-ratio via structure in low-dielectric material and method for manufacturing the same | Wei-Chung Wang, Po-Jen Cheng, Pei-Chun Chen | 2009-03-10 |
| 7196449 | Two-axis device and manufacturing method therefor | Mingching Wu, Hung-Yi Lin, Weileun Fang | 2007-03-27 |