Issued Patents All Time
Showing 25 most recent of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362316 | Electronic structure having a protrusion structure disposed in a gap between a circuit pattern structure and a packaging structure | Wei Wang, Fu-Yuan Chen | 2025-07-15 |
| 12183683 | Electronic package structure | Wei Wang, Fu-Yuan Chen | 2024-12-31 |
| 11961808 | Electronic package structure with reinforcement element | Wei Wang, Fu-Yuan Chen, Yi-Hsin Cheng | 2024-04-16 |
| 11923285 | Electronic device package and method of manufacturing the same | Chien-Fan Chen | 2024-03-05 |
| 11648034 | Device, instrument and belt for tying cervix | Chih-Wen Yang, Ting Chen, Tseng-Huang Liu | 2023-05-16 |
| 11404386 | Semiconductor device package and method of manufacturing the same | Po-Hsiang Wang, Fu-Yuan Chen, Wei Wang | 2022-08-02 |
| 11271207 | Electrolytic doping of non-electrolyte layers in printed batteries | John Devin MacKenzie, Christine Ho, Karthik Yogeeswaran | 2022-03-08 |
| 11197900 | Lactic acid bacteria and anti-inflammatory method thereof | Chia-Li Wei, Yu-Ting Wang, Tsung-Yi Li, Ya-Chen Huang | 2021-12-14 |
| 10918414 | Device, instrument and belt for tying cervix | Chih-Wen Yang, Ting Chen, Tseng-Huang Liu | 2021-02-16 |
| 10818925 | Electrolytic doping of non-electrolyte layers in printed batteries | John Devin MacKenzie, Christine Ho, Karthik Yogeeswaran | 2020-10-27 |
| 10230109 | Electrolytic doping of non-electrolyte layers in printed batteries | John Devin MacKenzie, Christine Ho, Karthik Yogeeswaran | 2019-03-12 |
| 9276292 | Electrolytic doping of non-electrolyte layers in printed batteries | John Devin MacKenzie, Christine Ho, Karthik Yogeeswaran | 2016-03-01 |
| 8288853 | Three-dimensional package and method of making the same | Min-Lung Huang, Wei-Chung Wang, Kuo-Chung Yee, Ching-Huei Su, Jian-Wen Lo +1 more | 2012-10-16 |
| 7863181 | Method for manufacturing a device having a high aspect ratio via | Hsueh-An Yang | 2011-01-04 |
| 7741152 | Three-dimensional package and method of making the same | Min-Lung Huang, Wei-Chung Wang, Kuo-Chung Yee, Ching-Huei Su, Jian-Wen Lo +1 more | 2010-06-22 |
| 7642132 | Three-dimensional package and method of making the same | Min-Lung Huang, Wei-Chung Wang, Kuo-Chung Yee, Ching-Huei Su, Jian-Wen Lo +1 more | 2010-01-05 |
| 7528053 | Three-dimensional package and method of making the same | Min-Lung Huang, Wei-Chung Wang, Kuo-Chung Yee, Ching-Huei Su, Jian-Wen Lo +1 more | 2009-05-05 |
| 7501342 | Device having high aspect-ratio via structure in low-dielectric material and method for manufacturing the same | Wei-Chung Wang, Hsueh-An Yang, Pei-Chun Chen | 2009-03-10 |
| 7500122 | Efficiency optimization method for hardware devices with adjustable clock frequencies | Ming-Ting Won, Fu-Shun Wu | 2009-03-03 |
| 7446404 | Three-dimensional package and method of making the same | Min-Lung Huang, Wei-Chung Wang, Kuo-Chung Yee, Ching-Huei Su, Jian-Wen Lo +1 more | 2008-11-04 |
| 7297080 | Game racquet with separate head and handle portions for reducing vibration | William D. Severa, Gerald J. LeVault, Donald G. Loeffler | 2007-11-20 |
| 7125745 | Multi-chip package substrate for flip-chip and wire bonding | Kun-Ching Chen, Yi Ding, Chih-Ming Chung, Yun-Hsiang Tien | 2006-10-24 |
| 6964624 | Bumper guard for a sports racquet | Walter Shen, David W. Repetto | 2005-11-15 |
| 6935975 | Racquet with channeled handle for receiving racquet string | Chin-Chi Chang | 2005-08-30 |
| 6891274 | Under-bump-metallurgy layer for improving adhesion | William T. Chen, Ho-Ming Tong, Chun-Chi Lee, Su Tao, Jeng-Da Wu +1 more | 2005-05-10 |