Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670836 | Semiconductor device package | Ting Ruei Chen, Hung-Hsiang Cheng, Guo-Cheng Liao | 2023-06-06 |
| 9219048 | Substrate having pillar group and semiconductor package having pillar group | Yi Ding | 2015-12-22 |
| 8089164 | Substrate having optional circuits and structure of flip chip bonding | Ko-Wei Lin, Kun-Ting Hung | 2012-01-03 |
| 7125745 | Multi-chip package substrate for flip-chip and wire bonding | Kun-Ching Chen, Yi Ding, Po-Jen Cheng, Chih-Ming Chung | 2006-10-24 |
| 7091583 | Method and structure for prevention leakage of substrate strip | Ying-Chih Chen, Ming-Jiun Lai, Yi Ding | 2006-08-15 |
| 6921981 | Ball grid array package | — | 2005-07-26 |