Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237395 | High electron mobility transistor and method for forming the same | Chun-Chieh Chiu, Chun-Ling Lin, Shu Min Huang, Hsin-Fu Huang | 2025-02-25 |
| 11856870 | MRAM structure and method of fabricating the same | Kuo-Chih Lai, Yi-Syun Chou, Pei-Hsun Kao, Wei Chen, Chia-Fu Cheng +2 more | 2023-12-26 |
| 11404631 | MRAM structure and method of fabricating the same | Kuo-Chih Lai, Yi-Syun Chou, Pei-Hsun Kao, Wei Chen, Chia-Fu Cheng +2 more | 2022-08-02 |
| 10756128 | Integrated circuit device and method of fabricating integrated circuit | Kuo-Chih Lai, Shih-Min Chou, Chin-Fu Lin, Wei-Chuan Tsai, Chun-Yao Yang +3 more | 2020-08-25 |
| 10446489 | Interconnect structure | Hung-Miao Lin, Chun-Ling Lin, Ying-Lien Chen, Huei-Ru Tsai, Sheng-Yi Su | 2019-10-15 |
| 10153231 | Interconnect structure and fabrication method thereof | Hung-Miao Lin, Chun-Ling Lin, Ying-Lien Chen, Huei-Ru Tsai, Sheng-Yi Su | 2018-12-11 |
| 10079177 | Method for forming copper material over substrate | Ying-Lien Chen, Chun-Ling Lin, Huei-Ru Tsai, Hung-Miao Lin, Sheng-Yi Su +1 more | 2018-09-18 |
| 9966425 | Method for fabricating a MIM capacitor | Jen-Po Huang, Chin-Fu Lin, Bin-Siang Tsai, Xu Yang Shen, Seng-Wah Liau +6 more | 2018-05-08 |
| 8389869 | Circuit board having pad and chip package structure thereof | — | 2013-03-05 |
| 8089164 | Substrate having optional circuits and structure of flip chip bonding | Yun-Hsiang Tien, Kun-Ting Hung | 2012-01-03 |