Ko-Wei Lin — 10 Patents at United Microelectronics

Ko-Wei Lin has been granted 10 US patents while listed as an inventor at United Microelectronics. The first was granted in 2012 and the most recent in February 2025. Ko-Wei Lin ranks #481,000 of 4,157,543 US inventors in our database (top 11.6%). Patent records list Ko-Wei Lin in Taichung, TW.

Patents per Year

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Showing 1–10 of 10 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12237395	High electron mobility transistor and method for forming the same	Chun-Chieh Chiu, Chun-Ling Lin, Shu Min Huang, Hsin-Fu Huang	2025-02-25
11856870	MRAM structure and method of fabricating the same	Kuo-Chih Lai, Yi-Syun Chou, Pei-Hsun Kao, Wei Chen, Chia-Fu Cheng +2 more	2023-12-26	$1,041,000
11404631	MRAM structure and method of fabricating the same	Kuo-Chih Lai, Yi-Syun Chou, Pei-Hsun Kao, Wei Chen, Chia-Fu Cheng +2 more	2022-08-02	$1,988,000
10756128	Integrated circuit device and method of fabricating integrated circuit	Kuo-Chih Lai, Shih-Min Chou, Chin-Fu Lin, Wei-Chuan Tsai, Chun-Yao Yang +3 more	2020-08-25	$509,000
10446489	Interconnect structure	Hung-Miao Lin, Chun-Ling Lin, Ying-Lien Chen, Huei-Ru Tsai, Sheng-Yi Su	2019-10-15	$144,000
10153231	Interconnect structure and fabrication method thereof	Hung-Miao Lin, Chun-Ling Lin, Ying-Lien Chen, Huei-Ru Tsai, Sheng-Yi Su	2018-12-11	$127,000
10079177	Method for forming copper material over substrate	Ying-Lien Chen, Chun-Ling Lin, Huei-Ru Tsai, Hung-Miao Lin, Sheng-Yi Su +1 more	2018-09-18	$224,000
9966425	Method for fabricating a MIM capacitor	Jen-Po Huang, Chin-Fu Lin, Bin-Siang Tsai, Xu Yang Shen, Seng-Wah Liau +6 more	2018-05-08	$213,000
8389869	Circuit board having pad and chip package structure thereof	—	2013-03-05	$706,000
8089164	Substrate having optional circuits and structure of flip chip bonding	Yun-Hsiang Tien, Kun-Ting Hung	2012-01-03	$1,981,000

Ko-Wei Lin — 10 Patents

Patents per Year

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