Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446489 | Interconnect structure | Ko-Wei Lin, Hung-Miao Lin, Chun-Ling Lin, Huei-Ru Tsai, Sheng-Yi Su | 2019-10-15 |
| 10153231 | Interconnect structure and fabrication method thereof | Ko-Wei Lin, Hung-Miao Lin, Chun-Ling Lin, Huei-Ru Tsai, Sheng-Yi Su | 2018-12-11 |
| 10079177 | Method for forming copper material over substrate | Ko-Wei Lin, Chun-Ling Lin, Huei-Ru Tsai, Hung-Miao Lin, Sheng-Yi Su +1 more | 2018-09-18 |