Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10446489 | Interconnect structure | Ko-Wei Lin, Hung-Miao Lin, Chun-Ling Lin, Huei-Ru Tsai, Sheng-Yi Su | 2019-10-15 | $144,000 |
| 10153231 | Interconnect structure and fabrication method thereof | Ko-Wei Lin, Hung-Miao Lin, Chun-Ling Lin, Huei-Ru Tsai, Sheng-Yi Su | 2018-12-11 | $127,000 |
| 10079177 | Method for forming copper material over substrate | Ko-Wei Lin, Chun-Ling Lin, Huei-Ru Tsai, Hung-Miao Lin, Sheng-Yi Su +1 more | 2018-09-18 | $224,000 |