{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Method for forming copper material over substrate", "item": "https://www.patentleaderboard.com/patent/10079177"}]}
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Method for forming copper material over substrate

US Patent 10079177 · Granted Sep 18, 2018

Estimated economic value: $224,000 ⓘ

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