| 12261350 |
Semiconductor device package and method of manufacturing the same |
Yi Ding |
2025-03-25 |
| 11721884 |
Semiconductor device package and method of manufacturing the same |
Yi Ding |
2023-08-08 |
| 11670836 |
Semiconductor device package |
Ting Ruei Chen, Hung-Hsiang Cheng, Yun-Hsiang Tien |
2023-06-06 |
| 11404799 |
Semiconductor device package and method of manufacturing the same |
Ting Ruei Chen |
2022-08-02 |
| 11362049 |
Semiconductor device package |
Yi Ding |
2022-06-14 |
| 11296001 |
Semiconductor device package and method of manufacturing the same |
Yi Ding |
2022-04-05 |
| 11217509 |
Semiconductor package structure |
Jyun-Chi Jhan |
2022-01-04 |
| 11107777 |
Substrate structure and semiconductor package structure including the same |
Yi Ding |
2021-08-31 |
| 10971798 |
Semiconductor device package and method of manufacturing the same |
Yi Ding |
2021-04-06 |
| 10847470 |
Semiconductor package structure and method for manufacturing the same |
Chia-Ching Chen, Yi Ding |
2020-11-24 |
| 9978705 |
Semiconductor substrate and semiconductor package structure having the same |
Chia-Ching Chen, Yi Ding |
2018-05-22 |
| 9437565 |
Semiconductor substrate and semiconductor package structure having the same |
Chia-Ching Chen, Yi Ding |
2016-09-06 |
| 9117697 |
Semiconductor substrate and method for making the same |
Chun-Che Lee, Yuan-Chang Su, Wen-Chi Cheng, Yi Ding |
2015-08-25 |
| 8531017 |
Semiconductor packages having increased input/output capacity and related methods |
— |
2013-09-10 |
| 8115104 |
Circuit board with buried conductive trace formed thereon and method for manufacturing the same |
— |
2012-02-14 |
| 7999389 |
Via hole structure with a conductive layer formed therein |
— |
2011-08-16 |
| 7994429 |
Manufacturing method and structure for a substrate with vertically embedded capacitor |
— |
2011-08-09 |
| 7816608 |
CTS and inspecting method thereof |
— |
2010-10-19 |
| 7763982 |
Package substrate strip, metal surface treatment method thereof and chip package structure |
— |
2010-07-27 |