Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11398421 | Semiconductor substrate and method for manufacturing the same | Ming-Chiang Lee, Yuan-Chang Su, Tien-Szu Chen, Chih-Cheng Lee, You-Lung Yen | 2022-07-26 |
| 10181438 | Semiconductor substrate mitigating bridging | Ming-Chiang Lee, Yuan-Chang Su, Tien-Szu Chen, Chih-Cheng Lee, You-Lung Yen | 2019-01-15 |
| 10049976 | Semiconductor substrate and manufacturing method thereof | Tien-Szu Chen, Sheng-Ming Wang, Kuang-Hsiung Chen, Yu-Ying Lee | 2018-08-14 |
| 9748594 | Polymer of fluorine-containing sulfonated poly(arylene ether)s and method of manufacturing the same | Wen-yao Huang, Hsu-Feng Lee, Benjamin Britton, Steven Holdcroft, Jun-jie Pang +2 more | 2017-08-29 |
| 9644069 | Polymer of fluorine-containing sulfonated poly(arylene ether)s and method of manufacturing the same | Wen-yao Huang, Hsu-Feng Lee, Benjamin Britton, Steven Holdcroft, Jun-jie Pang +2 more | 2017-05-09 |
| 9437532 | Substrate for semiconductor package and process for manufacturing | Tien-Szu Chen, Sheng-Ming Wang | 2016-09-06 |
| 9406658 | Embedded component device and manufacturing methods thereof | Yuan-Chang Su, Ming-Chiang Lee, Shih-Fu Huang | 2016-08-02 |
| 9224707 | Substrate for semiconductor package and process for manufacturing | Tien-Szu Chen, Sheng-Ming Wang | 2015-12-29 |
| 9209472 | Polymer of sulfonated poly(arylene ether)s and manufacturing method thereof | Wen-yao Huang, Hsu-Feng Lee, Steven Holdcroft | 2015-12-08 |
| 9117697 | Semiconductor substrate and method for making the same | Yuan-Chang Su, Wen-Chi Cheng, Guo-Cheng Liao, Yi Ding | 2015-08-25 |
| 9018336 | Polymer of sulfonated poly(arlene ether)s and manufacturing method thereof | Wen-yao Huang, Hsu-Feng Lee, Steven Holdcroft | 2015-04-28 |
| 8987407 | Fuel cell catalyst layer having sulfonated poly(arylene ether)s and manufacturing method thereof | Wen-yao Huang, Hsu-Feng Lee, Steven Holdcroft | 2015-03-24 |
| 8884443 | Substrate for semiconductor package and process for manufacturing | Tien-Szu Chen, Sheng-Ming Wang | 2014-11-11 |
| 8720053 | Process of fabricating a circuit board | Shih-Chang Lee, Kun-Ching Chen, Ming-Loung Lu | 2014-05-13 |
| 8309400 | Leadframe package structure and manufacturing method thereof | Bernd Karl Appelt, Kay Stefan Essig, Yuan-Chang Su, Kuang-Hsiung Chen | 2012-11-13 |
| 8143770 | LED bulb structure having insertion end, and/or heat dissipation element, and/or heat-and-electricity separated element | Cheng-Wei Chan, Ming-Hung Chen, Shih-Yi Wen | 2012-03-27 |
| 7910395 | LED structure | Shih-Chang Shei, Ming-Hung Chen, Shih-Yi Wen | 2011-03-22 |
| 5982625 | Semiconductor packaging device | Kun-Ching Chen, Tao-Yu Chen, Yung-I Yeh, Wu Wang, Chun-Hsiung Huang +1 more | 1999-11-09 |