| 12328564 |
Method and apparatus for performing audio enhancement with aid of timing control |
Hsi-Hsien Chen, Yili Wang, Chia-Wei Tao |
2025-06-10 |
|
| 11894308 |
Semiconductor package and method of manufacturing the same |
Tien-Szu Chen, Wen-Chih Shen, Hsing-Wen Lee, Hsiang-Ming Feng |
2024-02-06 |
$1,209,000 |
| 10879159 |
Substrate, semiconductor package thereof and process of making same |
Tien-Szu Chen, Kuang-Hsiung Chen, Yu-Ying Lee |
2020-12-29 |
$3,350,000 |
| 10854550 |
Semiconductor package and method of manufacturing the same |
Tien-Szu Chen, Wen-Chih Shen, Hsing-Wen Lee, Hsiang-Ming Feng |
2020-12-01 |
$1,621,000 |
| 10734337 |
Semiconductor package device having glass transition temperature greater than binding layer temperature |
Kuang-Hsiung Chen, Yu-Hsuan Tsai, Yu-Ying Lee, Wun-Jheng Syu |
2020-08-04 |
$1,717,000 |
| 10629519 |
Semiconductor device package and method of manufacturing the same |
Tien-Szu Chen, I-Cheng Wang, Wun-Jheng Syu |
2020-04-21 |
$911,000 |
| 10573624 |
Semiconductor device package and method of manufacturing the same |
Tien-Szu Chen, Kuang-Hsiung Chen, I-Cheng Wang, Wun-Jheng Syu |
2020-02-25 |
$2,524,000 |
| 10515884 |
Substrate having a conductive structure within photo-sensitive resin |
Tien-Szu Chen, Kuang-Hsiung Chen, Yu-Ying Lee, Li-Chuan Tsai, Chih-Cheng Lee |
2019-12-24 |
$1,370,000 |
| 10446411 |
Semiconductor device package with a conductive post |
Tien-Szu Chen, Kuang-Hsiung Chen, Yu-Ying Lee, Yu-Tzu Peng |
2019-10-15 |
$1,323,000 |
| 10383273 |
Coastal severe saline-alkali soil improvement and vegetation construction system |
— |
2019-08-20 |
|
| 10332851 |
Semiconductor device package and a method of manufacturing the same |
Chung-Chieh Yang, Tien-Szu Chen |
2019-06-25 |
$728,000 |
| 10224298 |
Semiconductor package device having glass transition temperature greater than binding layer temperature |
Kuang-Hsiung Chen, Yu-Hsuan Tsai, Yu-Ying Lee, Wun-Jheng Syu |
2019-03-05 |
$1,850,000 |
| 10157887 |
Semiconductor device package and method of manufacturing the same |
Tien-Szu Chen, Kuang-Hsiung Chen, I-Cheng Wang, Wun-Jheng Syu |
2018-12-18 |
$1,395,000 |
| 10134683 |
Semiconductor device package and method of manufacturing the same |
Tien-Szu Chen, Kuang-Hsiung Chen, I-Cheng Wang, Wun-Jheng Syu, Yu-Tzu Peng |
2018-11-20 |
$1,995,000 |
| 10103110 |
Semiconductor package structure and fabrication method thereof |
Tien-Szu Chen, Kuang-Hsiung Chen, Yu-Ying Lee |
2018-10-16 |
$2,106,000 |
| 10049976 |
Semiconductor substrate and manufacturing method thereof |
Tien-Szu Chen, Chun-Che Lee, Kuang-Hsiung Chen, Yu-Ying Lee |
2018-08-14 |
$2,493,000 |
| 10049893 |
Semiconductor device with a conductive post |
Tien-Szu Chen, Kuang-Hsiung Chen, Yu-Ying Lee, Yu-Tzu Peng |
2018-08-14 |
$2,493,000 |
| 10002843 |
Semiconductor substrate structure, semiconductor package and method of manufacturing the same |
Tien-Szu Chen, Kuang-Hsiung Chen, Yu-Ying Lee |
2018-06-19 |
$2,323,000 |
| 9984989 |
Semiconductor substrate and semiconductor package structure |
Tien-Szu Chen, Kuang-Hsiung Chen, Yu-Ying Lee |
2018-05-29 |
$795,000 |
| 9911702 |
Semiconductor package structure and fabrication method thereof |
Tien-Szu Chen, Kuang-Hsiung Chen, Yu-Ying Lee |
2018-03-06 |
$1,587,000 |
| 9486150 |
Method of signal enhancement for ECG devices |
Zhendgong Song |
2016-11-08 |
$29,226,000 |
| 9437532 |
Substrate for semiconductor package and process for manufacturing |
Tien-Szu Chen, Chun-Che Lee |
2016-09-06 |
$3,410,000 |
| 9224707 |
Substrate for semiconductor package and process for manufacturing |
Tien-Szu Chen, Chun-Che Lee |
2015-12-29 |
$5,655,000 |
| 9054118 |
Heat dissipating semiconductor device packages and related methods |
Kuang-Hsiung Chen, Yu-Ying Lee, Hsiang-Ming Feng, Bing-Yun Cheng |
2015-06-09 |
$4,780,000 |
| 8884443 |
Substrate for semiconductor package and process for manufacturing |
Tien-Szu Chen, Chun-Che Lee |
2014-11-11 |
$1,802,000 |
