Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
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Yu-Hsuan Tsai — 13 Patents

AEAdvanced Semiconductor Engineering: 12 patents #100 of 1,073Top 10%
KTKingpak Technology: 1 patents #48 of 84Top 60%
Hengshan, TW: #153 of 1,564 inventorsTop 10%
Overall (All Time): #362,438 of 4,157,543Top 9%
13 Patents All Time
Yu-Hsuan Tsai has been granted 13 US patents while listed as an inventor at Advanced Semiconductor Engineering. The first was granted in 2017 and the most recent in January 2023. Yu-Hsuan Tsai ranks #362,438 of 4,157,543 US inventors in our database (top 8.7%). Patent records list Yu-Hsuan Tsai in Hengshan, TW.

Patents per Year

Patents granted per year, 2017 to 2023Bar chart with a peak of 6 patents in 2020.peak 62017: 1 patents20172019: 2 patents20192020: 6 patents20202021: 3 patents20212023: 1 patents2023

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
11565934 Semiconductor package structures and methods of manufacturing the same Lu-Ming Lai, Chien-Wei Fang, Ching-Han Huang 2023-01-31 $1,878,000
11174157 Semiconductor device packages and methods of manufacturing the same Chi-Sheng Tseng, Lu-Ming Lai, Yin Chen, Hsin-Lin WU, San Yu 2021-11-16 $3,120,000
11101189 Semiconductor device package and method of manufacturing the same Ming-Yen Lee, Chia-Hao Sung, Ching-Han Huang 2021-08-24 $2,094,000
11081413 Semiconductor package with inner and outer cavities Hsin-Lin WU, Chang Chin Tsai, Lu-Ming Lai, Ching-Han Huang 2021-08-03 $3,865,000
10841679 Microelectromechanical systems package structure Hsu-Liang Hsiao, Pu-Shan Huang, Ching-Han Huang, Lu-Ming Lai 2020-11-17 $2,015,000
10804413 Package component 2020-10-13
10734337 Semiconductor package device having glass transition temperature greater than binding layer temperature Kuang-Hsiung Chen, Yu-Ying Lee, Sheng-Ming Wang, Wun-Jheng Syu 2020-08-04 $1,717,000
10720751 Optical package structure, optical module, and method for manufacturing the same Lu-Ming Lai, Ying-Chung Chen, Shih-Chieh Tang 2020-07-21 $5,057,000
10689248 Semiconductor device package and method of manufacturing the same Ming-Yen Lee, Chia-Hao Sung, Ching-Han Huang 2020-06-23 $1,624,000
10526200 Semiconductor device package including cover including tilted inner sidewall Ching-Han Huang, Hsun-Wei Chan 2020-01-07 $1,755,000
10224298 Semiconductor package device having glass transition temperature greater than binding layer temperature Kuang-Hsiung Chen, Yu-Ying Lee, Sheng-Ming Wang, Wun-Jheng Syu 2019-03-05 $1,850,000
10170658 Semiconductor package structures and method of manufacturing the same Lu-Ming Lai 2019-01-01
9850124 Semiconductor device package for reducing parasitic light and method of manufacturing the same Ching-Han Huang, Hsun-Wei Chan 2017-12-26 $1,194,000