Yu-Hsuan Tsai has been granted 13 US patents while listed as an inventor at Advanced Semiconductor Engineering . The first was granted in 2017 and the most recent in January 2023. Yu-Hsuan Tsai ranks #362,438 of 4,157,543 US inventors in our database (top 8.7%). Patent records list Yu-Hsuan Tsai in Hengshan, TW.
Patents per Year Patents granted per year, 2017 to 2023 Bar chart with a peak of 6 patents in 2020. peak 6 2017: 1 patents 2017 2019: 2 patents 2019 2020: 6 patents 2020 2021: 3 patents 2021 2023: 1 patents 2023
Issued Patents All Time
Showing 1–13 of 13 patents
Patent # Title Co-Inventors Date Approx Value ⓘ
11565934
Semiconductor package structures and methods of manufacturing the same
Lu-Ming Lai , Chien-Wei Fang , Ching-Han Huang
2023-01-31
$1,878,000
11174157
Semiconductor device packages and methods of manufacturing the same
Chi-Sheng Tseng , Lu-Ming Lai , Yin Chen , Hsin-Lin WU , San Yu
2021-11-16
$3,120,000
11101189
Semiconductor device package and method of manufacturing the same
Ming-Yen Lee , Chia-Hao Sung , Ching-Han Huang
2021-08-24
$2,094,000
11081413
Semiconductor package with inner and outer cavities
Hsin-Lin WU , Chang Chin Tsai , Lu-Ming Lai , Ching-Han Huang
2021-08-03
$3,865,000
10841679
Microelectromechanical systems package structure
Hsu-Liang Hsiao , Pu-Shan Huang , Ching-Han Huang , Lu-Ming Lai
2020-11-17
$2,015,000
10804413
Package component
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2020-10-13
10734337
Semiconductor package device having glass transition temperature greater than binding layer temperature
Kuang-Hsiung Chen , Yu-Ying Lee , Sheng-Ming Wang , Wun-Jheng Syu
2020-08-04
$1,717,000
10720751
Optical package structure, optical module, and method for manufacturing the same
Lu-Ming Lai , Ying-Chung Chen , Shih-Chieh Tang
2020-07-21
$5,057,000
10689248
Semiconductor device package and method of manufacturing the same
Ming-Yen Lee , Chia-Hao Sung , Ching-Han Huang
2020-06-23
$1,624,000
10526200
Semiconductor device package including cover including tilted inner sidewall
Ching-Han Huang , Hsun-Wei Chan
2020-01-07
$1,755,000
10224298
Semiconductor package device having glass transition temperature greater than binding layer temperature
Kuang-Hsiung Chen , Yu-Ying Lee , Sheng-Ming Wang , Wun-Jheng Syu
2019-03-05
$1,850,000
10170658
Semiconductor package structures and method of manufacturing the same
Lu-Ming Lai
2019-01-01
9850124
Semiconductor device package for reducing parasitic light and method of manufacturing the same
Ching-Han Huang , Hsun-Wei Chan
2017-12-26
$1,194,000