Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400944 | Board-level pad pattern for multi-row QFN packages | Hui-Chi Tang, Hsuan-Yi Lin, Shao-Chun Ho, Yi Wen Chiang | 2025-08-26 |
| 12309921 | Board-level pad pattern for multi-row QFN packages | Hui-Chi Tang, Shao-Chun Ho, Hsuan-Yi Lin | 2025-05-20 |
| 10841679 | Microelectromechanical systems package structure | Hsu-Liang Hsiao, Yu-Hsuan Tsai, Ching-Han Huang, Lu-Ming Lai | 2020-11-17 |