| 12400944 |
Board-level pad pattern for multi-row QFN packages |
Hsuan-Yi Lin, Shao-Chun Ho, Yi Wen Chiang, Pu-Shan Huang |
2025-08-26 |
| 12309921 |
Board-level pad pattern for multi-row QFN packages |
Shao-Chun Ho, Hsuan-Yi Lin, Pu-Shan Huang |
2025-05-20 |
| 11791178 |
Compliant mechanical system for mini/micro chip mass transfer and packaging |
Zhishen Liao, Xin Chen, Zhihang Lin, Jian Gao, Qiang Liu +1 more |
2023-10-17 |
| 11715655 |
Flexure-based continuous ejector pin mechanism for mini/micro chip mass transfer |
Xin Chen, Zhihang Lin, Hongcheng Li, Jian Gao, Qiang Liu +1 more |
2023-08-01 |
| 10239167 |
Stiffness-frequency adjustable XY micromotion stage based on stress stiffening |
Zhijun Yang, Youdun Bai, Xin Chen, Jian Gao, Haidong Yang +1 more |
2019-03-26 |
| 9846756 |
Layout method for printed circuit board |
Fu-Kang Pan, Nan-Cheng Chen, Shih-Chieh Lin, Ying-Lin Liu, Yang Liu +1 more |
2017-12-19 |
| 9158880 |
Layout method for printed circuit board |
Fu-Kang Pan, Nan-Cheng Chen, Shih-Chieh Lin, Ying-Lin Liu, Yang Liu |
2015-10-13 |