| 12352602 |
Optical module and method of making the same |
Ying-Chung Chen, Hsun-Wei Chan, Kuang-Hsiung Chen |
2025-07-08 |
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| 12321513 |
Body-part tracking device and body-part tracking method |
Chi-Sheng Tseng, Hui-Chung Liu, I Hung Wu, Kai-Sheng PAI |
2025-06-03 |
|
| 12184266 |
Electronic package structure |
Chi-Sheng Tseng, Ching-Han Huang, Kuo-Hua LAI, Hui-Chung Liu |
2024-12-31 |
$1,714,000 |
| 12168605 |
Semiconductor device package and a method of manufacturing the same |
Hsu-Liang Hsiao, Ching-Han Huang, Chia-Hung Shen |
2024-12-17 |
$3,480,000 |
| 12085768 |
Optical module |
Shih-Chieh Tang, Yu-Che Huang, Ying-Chung Chen |
2024-09-10 |
$2,949,000 |
| 11835363 |
Optical module and method of making the same |
Ying-Chung Chen, Hsun-Wei Chan, Kuang-Hsiung Chen |
2023-12-05 |
$1,264,000 |
| 11817397 |
Semiconductor device package |
Chi-Sheng Tseng, Hui-Chung Liu, Yu-Che Huang |
2023-11-14 |
$2,510,000 |
| 11784296 |
Semiconductor device package and a method of manufacturing the same |
Mei-Yi Wu, Yu-Ying Lee, Yung-Yi Chang |
2023-10-10 |
$1,593,000 |
| 11682684 |
Optical package structure |
Cheng-Ling Huang, Ying-Chung Chen |
2023-06-20 |
$1,459,000 |
| 11588470 |
Semiconductor package structure and method of manufacturing the same |
Chi-Sheng Tseng, Ching-Han Huang, Kuo-Hua LAI, Hui-Chung Liu |
2023-02-21 |
$1,541,000 |
| 11588081 |
Semiconductor device package |
Hsin-Ying Ho, Hsun-Wei Chan, Shih-Chieh Tang |
2023-02-21 |
$1,541,000 |
| 11565934 |
Semiconductor package structures and methods of manufacturing the same |
Yu-Hsuan Tsai, Chien-Wei Fang, Ching-Han Huang |
2023-01-31 |
$1,878,000 |
| 11562969 |
Semiconductor device package including reinforced structure |
Yu-Che Huang |
2023-01-24 |
$7,908,000 |
| 11535509 |
Semiconductor package structure and method for manufacturing the same |
Wei Liu, Huei-Siang WONG |
2022-12-27 |
$1,115,000 |
| 11495511 |
Semiconductor package structure and method for manufacturing the same |
Yu-Che Huang, Ying-Chung Chen |
2022-11-08 |
$2,199,000 |
| 11437292 |
Semiconductor package device and method of manufacturing the same |
Wei Liu, Huei-Siang WONG |
2022-09-06 |
$1,464,000 |
| 11427466 |
Semiconductor package structure and method for manufacturing the same |
Wei Liu, Huei-Siang WONG |
2022-08-30 |
$854,000 |
| 11296651 |
Semiconductor package structure |
Chi-Sheng Tseng, Ching-Han Huang, Hui-Chung Liu, Kuo-Hua LAI, Cheng-Ling Huang |
2022-04-05 |
$1,088,000 |
| 11276720 |
Optical package |
Shih-Chieh Tang, Chia-Yun Hsu |
2022-03-15 |
$970,000 |
| 11276797 |
Optical device and method of manufacturing the same |
Hsiang-Cheng Tsai, Hsun-Wei Chan, Ying-Chung Chen |
2022-03-15 |
$970,000 |
| 11276806 |
Semiconductor device package and method for manufacturing the same |
Yi Wen Chiang, Kuang-Hsiung Chen, Hsun-Wei Chan, Hsin-Ying Ho, Shih-Chieh Tang |
2022-03-15 |
$970,000 |
| 11262197 |
Optical module and method of making the same |
Ying-Chung Chen, Hsun-Wei Chan, Kuang-Hsiung Chen |
2022-03-01 |
$2,064,000 |
| 11217499 |
Semiconductor package structure and method for manufacturing the same |
Chi-Sheng Tseng, Hui-Chung Liu |
2022-01-04 |
$1,679,000 |
| 11211536 |
Semiconductor device package and a method of manufacturing the same |
Mei-Yi Wu, Yu-Ying Lee, Yung-Yi Chang |
2021-12-28 |
$1,576,000 |
| 11174157 |
Semiconductor device packages and methods of manufacturing the same |
Chi-Sheng Tseng, Yu-Hsuan Tsai, Yin Chen, Hsin-Lin WU, San Yu |
2021-11-16 |
$3,120,000 |