Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315785 | Semiconductor device package | — | 2025-05-27 |
| 12033934 | Package structure, optical structure and method for manufacturing the same | — | 2024-07-09 |
| 11862550 | Electronic package structure and method of manufacturing the same | — | 2024-01-02 |
| 11784296 | Semiconductor device package and a method of manufacturing the same | Mei-Yi Wu, Lu-Ming Lai, Yung-Yi Chang | 2023-10-10 |
| 11569179 | Package structure including an outer lead portion and an inner lead portion and method for manufacturing package structure | — | 2023-01-31 |
| 11469165 | Semiconductor device package | — | 2022-10-11 |
| 11211536 | Semiconductor device package and a method of manufacturing the same | Mei-Yi Wu, Lu-Ming Lai, Yung-Yi Chang | 2021-12-28 |
| 10879159 | Substrate, semiconductor package thereof and process of making same | Tien-Szu Chen, Sheng-Ming Wang, Kuang-Hsiung Chen | 2020-12-29 |
| 10741482 | Semiconductor device package | — | 2020-08-11 |
| 10734337 | Semiconductor package device having glass transition temperature greater than binding layer temperature | Kuang-Hsiung Chen, Yu-Hsuan Tsai, Sheng-Ming Wang, Wun-Jheng Syu | 2020-08-04 |
| 10665765 | Semiconductor device package and a method of manufacturing the same | Mei-Yi Wu, Lu-Ming Lai, Yung-Yi Chang | 2020-05-26 |
| 10515884 | Substrate having a conductive structure within photo-sensitive resin | Tien-Szu Chen, Kuang-Hsiung Chen, Sheng-Ming Wang, Li-Chuan Tsai, Chih-Cheng Lee | 2019-12-24 |
| 10483196 | Embedded trace substrate structure and semiconductor package structure including the same | — | 2019-11-19 |
| 10446411 | Semiconductor device package with a conductive post | Tien-Szu Chen, Kuang-Hsiung Chen, Sheng-Ming Wang, Yu-Tzu Peng | 2019-10-15 |
| 10224298 | Semiconductor package device having glass transition temperature greater than binding layer temperature | Kuang-Hsiung Chen, Yu-Hsuan Tsai, Sheng-Ming Wang, Wun-Jheng Syu | 2019-03-05 |
| 10103110 | Semiconductor package structure and fabrication method thereof | Tien-Szu Chen, Sheng-Ming Wang, Kuang-Hsiung Chen | 2018-10-16 |
| 10049893 | Semiconductor device with a conductive post | Tien-Szu Chen, Kuang-Hsiung Chen, Sheng-Ming Wang, Yu-Tzu Peng | 2018-08-14 |
| 10049976 | Semiconductor substrate and manufacturing method thereof | Tien-Szu Chen, Chun-Che Lee, Sheng-Ming Wang, Kuang-Hsiung Chen | 2018-08-14 |
| 10002843 | Semiconductor substrate structure, semiconductor package and method of manufacturing the same | Tien-Szu Chen, Kuang-Hsiung Chen, Sheng-Ming Wang | 2018-06-19 |
| 9984989 | Semiconductor substrate and semiconductor package structure | Tien-Szu Chen, Sheng-Ming Wang, Kuang-Hsiung Chen | 2018-05-29 |
| 9911702 | Semiconductor package structure and fabrication method thereof | Tien-Szu Chen, Sheng-Ming Wang, Kuang-Hsiung Chen | 2018-03-06 |
| 9054118 | Heat dissipating semiconductor device packages and related methods | Kuang-Hsiung Chen, Sheng-Ming Wang, Hsiang-Ming Feng, Bing-Yun Cheng | 2015-06-09 |
| 8779581 | Heat dissipating semiconductor device packages | Kuang-Hsiung Chen, Sheng-Ming Wang, Hsiang-Ming Feng, Bing-Yun Cheng | 2014-07-15 |
| 8592962 | Semiconductor device packages with protective layer and related methods | Kuang-Hsiung Chen, Sheng-Ming Wang, Hsiang-Ming Feng, Mei-Lin Hsieh | 2013-11-26 |