Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450596 | Lead frame, package structure and method for manufacturing the same | Yi-Cheng Hsu, Chih-Hung Hsu, Yuan-Chun Chen, Yu-Shun Hsieh, Ko-Pu WU +1 more | 2022-09-20 |
| 11139225 | Device including a plurality of leads surrounding a die paddle and method for manufacturing the same | Kuang-Hsiung Chen, Chih-Hung Hsu, Yi-Cheng Hsu, Yuan-Chun Chen, Yu-Shun Hsieh +1 more | 2021-10-05 |
| 8592962 | Semiconductor device packages with protective layer and related methods | Kuang-Hsiung Chen, Sheng-Ming Wang, Hsiang-Ming Feng, Yu-Ying Lee | 2013-11-26 |
| 8304865 | Leadframe and chip package | Yueh Hsu, Chih-Hung Hsu, Kuang-Hsiung Chen, Yi-Cheng Hsu | 2012-11-06 |